Abstract:
Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
Abstract:
An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P 2 = 2LD/N, wherein N is an integer with N ≥ 1. High- contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.
Abstract:
The method for manufacturing optical light guide elements comprises a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement. The method further comprises at least one of the following steps d), d′), d″): d) segmenting the bar arrangement into bars referred to as prism bars each of which comprises a portion of at least two different ones of the plurality of initial bars, by conducting a plurality of cuts through the bar arrangement; in particular wherein the cuts are parallel cuts; d′) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into parts along cut lines, wherein the cut lines are at an angle with the initial-bar directions; d″) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into sections by creating cut faces which are at an angle with respect to the initial-bar directions. And the method further comprises e) segmenting the prism bars into parts.
Abstract:
An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.
Abstract:
Fabricating an optics wafer includes providing a wafer (8) comprising a core region (9) composed of a glass-reinforced epoxy, the wafer (8) further comprising a first resin layer (10A) on a top surface of the core region (9) and a second resin layer (10B) on a bottom surface of the core region (9). The core region (9) and first and second resin layers (10A,10B) are substantially non-transparent for a specific range of the electromagnetic spectrum. The wafer (8) further includes vertical transparent regions (6) that extend through the core region (9) and the first and second resin layers (10A,10B) and are composed of a material that is substantially transparent for the specific range of the electromagnetic spectrum. The wafer (8) is thinned, for example by polishing, from its top surface and its bottom surface so that a resulting thickness is within a predetermined range without causing glass fibers of the core region (9) to become exposed. Respective optical structures are provided on one or more exposed surfaces of at least some of the transparent regions (6).
Abstract:
This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.