公开(公告)号：EP1202328A2

公开(公告)日：2002-05-02

申请号：EP01125853.0

申请日：2001-10-30

申请人： Heraeus Quarzglas GmbH & Co. KG ,  Shin-Etsu Quartz Products Co.,Ltd. ,  Yamagata Shin-Etsu Quartz Co. Ltd.

发明人： Saito, Makoto ,  Konno, Toshiaki

IPC分类号： H01L21/00

CPC分类号： C23C16/4581 ,  C23C16/4401 ,  F27D5/0006 ,  H01L21/68735 ,  Y10T156/1052

摘要： An object of the present invention is to provide a novel wafer support jig and a process for producing the same, said wafer support jig capable of considerably suppressing the generation of particles in the wafer heat treatment process, e.g., a CVD process, during the production of semiconductors. In order to solve the problems a quartz glass wafer support jig is suggested comprising a plurality of support pillars having provided thereto a plurality of ring-shaped support plates for mounting thereon the wafers, said support plates being superposed one after another with a predetermined distance taken between the neighboring plates in the vertical direction, a quartz glass wafer support jig characterized in that it comprises said ring-shaped support plates each having its upper and lower surfaces precisely polished and each having provided with chamfered portions formed by chamfering the upper and lower edge portions of the outer and inner peripheries thereof.

公开(公告)号：EP1202328A3

公开(公告)日：2006-05-31

申请号：EP01125853.0

申请日：2001-10-30

申请人： Heraeus Quarzglas GmbH & Co. KG ,  SHIN-ETSU QUARTZ PRODUCTS CO., LTD. ,  Yamagata Shin-Etsu Quartz Co. Ltd.

发明人： Saito, Makoto ,  Konno, Toshiaki

IPC分类号： H01L21/68 ,  C23C14/50 ,  F27D5/00 ,  H01L21/00

CPC分类号： C23C16/4581 ,  C23C16/4401 ,  F27D5/0006 ,  H01L21/68735 ,  Y10T156/1052

摘要： An object of the present invention is to provide a novel wafer support jig and a process for producing the same, said wafer support jig capable of considerably suppressing the generation of particles in the wafer heat treatment process, e.g., a CVD process, during the production of semiconductors. In order to solve the problems a quartz glass wafer support jig is suggested comprising a plurality of support pillars having provided thereto a plurality of ring-shaped support plates for mounting thereon the wafers, said support plates being superposed one after another with a predetermined distance taken between the neighboring plates in the vertical direction, a quartz glass wafer support jig characterized in that it comprises said ring-shaped support plates each having its upper and lower surfaces precisely polished and each having provided with chamfered portions formed by chamfering the upper and lower edge portions of the outer and inner peripheries thereof.

摘要翻译： 本发明的目的是提供一种新颖的晶片支撑夹具及其制造方法，所述晶片支撑夹具能够显着地抑制晶片热处理过程中的颗粒的产生，例如在生产过程中的CVD工艺 的半导体。 为了解决这些问题，提出了一种石英玻璃晶片支撑夹具，其包括多个支撑柱，其中提供有多个环形支撑板用于在其上安装晶片，所述支撑板以预定距离一个接一个地重叠 在相邻的板之间的垂直方向上的石英玻璃晶片支撑夹具，其特征在于，其包括所述环形支撑板，每个所述环形支撑板的上表面和下表面精确抛光，并且每个都具有倒角部分，该倒角部分通过倒角上下边缘 其外周和外周的部分。