摘要:
A process for manufacturing a thin film resistor substrate useful, for example, in fabricating an ink jet printhead, wherein discontinuous strips (20,22) of conductive material are initially patterned on the surface of a resistive layer (16). These strips are formed using a first series of masking and etching steps to define an "X" dimension of a resistive heater element (24). Then, the conductive strips (20,22) and resistive material therebetween are completely masked (26) in preparation for a subsequent, second etching step used to remove the exposed portions of the resistive layer (16) and thereby define a "Y" dimension of the resistive heater element (24). These steps leave smooth contours, good step coverage and high quality bevelled edges (39,40) of the thus defined conductive and resistive layers. These layers are now ready for subsequent passivation layer (42), barrier layer (44) and orifice plate (48) deposition processes to complete a thin film printhead for use in an ink jet printer.
摘要:
An ink fill slot 18 can be precisely manufactured in a substrate 12 utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots may be appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead.
摘要:
An ink fill slot 18 can be precisely manufactured in a substrate 12 utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots may be appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead.
摘要:
A process for manufacturing a thin film resistor substrate useful, for example, in fabricating an ink jet printhead, wherein discontinuous strips (20,22) of conductive material are initially patterned on the surface of a resistive layer (16). These strips are formed using a first series of masking and etching steps to define an "X" dimension of a resistive heater element (24). Then, the conductive strips (20,22) and resistive material therebetween are completely masked (26) in preparation for a subsequent, second etching step used to remove the exposed portions of the resistive layer (16) and thereby define a "Y" dimension of the resistive heater element (24). These steps leave smooth contours, good step coverage and high quality bevelled edges (39,40) of the thus defined conductive and resistive layers. These layers are now ready for subsequent passivation layer (42), barrier layer (44) and orifice plate (48) deposition processes to complete a thin film printhead for use in an ink jet printer.