Thin film device for an ink jet printhead and process for manufacturing same
    1.
    发明公开
    Thin film device for an ink jet printhead and process for manufacturing same 失效
    DünnschichtanordnungfürTintenspritzdruckkopf und Verfahren zu deren Herstellung。

    公开(公告)号:EP0320192A2

    公开(公告)日:1989-06-14

    申请号:EP88311513.1

    申请日:1988-12-05

    摘要: A process for manufacturing a thin film resistor substrate useful, for example, in fabricating an ink jet printhead, wherein discontinuous strips (20,22) of conductive material are initially patterned on the surface of a resistive layer (16). These strips are formed using a first series of masking and etching steps to define an "X" dimension of a resistive heater element (24). Then, the conductive strips (20,22) and resistive material therebetween are completely masked (26) in preparation for a subsequent, second etching step used to remove the exposed portions of the resistive layer (16) and thereby define a "Y" dimension of the resistive heater element (24). These steps leave smooth contours, good step coverage and high quality bevelled edges (39,40) of the thus defined conductive and resistive layers. These layers are now ready for subsequent passivation layer (42), barrier layer (44) and orifice plate (48) deposition processes to complete a thin film printhead for use in an ink jet printer.

    摘要翻译: 一种用于制造薄膜电阻器基底的方法,例如可用于制造喷墨打印头,其中导电材料的不连续条带(20,22)最初在电阻层(16)的表面上被图案化。 使用第一系列掩模和蚀刻步骤形成这些条,以限定电阻加热元件(24)的“X”尺寸。 然后,导电条(20,22)和其间的电阻材料被完全掩蔽(26),以准备用于去除电阻层(16)的暴露部分的随后的第二蚀刻步骤,从而限定“Y”维 的电阻加热器元件(24)。 这些步骤使得如此定义的导电层和电阻层具有平滑的轮廓,良好的阶梯覆盖和高质量斜边(39,40)。 这些层现在可以用于随后的钝化层(42),阻挡层(44)和孔板(48)沉积工艺,以完成用于喷墨打印机的薄膜打印头。

    Method for manufacturing a thermal ink-jet print head
    2.
    发明公开
    Method for manufacturing a thermal ink-jet print head 失效
    Verfahren zum Herstellen eines thermischen Farbstrahldruckkopfs。

    公开(公告)号:EP0609012A2

    公开(公告)日:1994-08-03

    申请号:EP94300395.4

    申请日:1994-01-19

    IPC分类号: B41J2/16

    摘要: An ink fill slot 18 can be precisely manufactured in a substrate 12 utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots may be appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead.

    摘要翻译: 墨水填充槽18可以利用具有化学蚀刻,等离子体蚀刻或其组合的光刻技术在衬底12中精确地制造。 这些方法可以与激光烧蚀,机械磨蚀或机电加工结合使用以去除所需区域中的附加基材。 墨水填充槽可以适当地构造成以越来越高的打印头的操作频率提供所需的墨水量。

    Method for manufacturing a thermal ink-jet print head
    3.
    发明公开
    Method for manufacturing a thermal ink-jet print head 失效
    制造热喷墨打印头的方法

    公开(公告)号:EP0609012A3

    公开(公告)日:1994-09-14

    申请号:EP94300395.4

    申请日:1994-01-19

    IPC分类号: B41J2/16

    摘要: An ink fill slot 18 can be precisely manufactured in a substrate 12 utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots may be appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead.

    摘要翻译: 利用光刻技术,利用化学蚀刻,等离子体蚀刻或其组合,可以在衬底12中精确制造油墨填充槽18。 这些方法可以与激光烧蚀,机械磨蚀或机电加工结合使用,以去除所需区域中的附加基底材料。 油墨填充槽可以被适当地构造成以越来越高的打印头操作频率提供必要的油墨量。

    Thin film device for an ink jet printhead and process for manufacturing same
    4.
    发明公开
    Thin film device for an ink jet printhead and process for manufacturing same 失效
    喷墨打印机的薄膜装置及其制造方法

    公开(公告)号:EP0320192A3

    公开(公告)日:1990-07-25

    申请号:EP88311513.1

    申请日:1988-12-05

    摘要: A process for manufacturing a thin film resistor substrate useful, for example, in fabricating an ink jet printhead, wherein discontinuous strips (20,22) of conductive material are initially patterned on the surface of a resistive layer (16). These strips are formed using a first series of masking and etching steps to define an "X" dimension of a resistive heater element (24). Then, the conductive strips (20,22) and resistive material therebetween are completely masked (26) in preparation for a subsequent, second etching step used to remove the exposed portions of the resistive layer (16) and thereby define a "Y" dimension of the resistive heater element (24). These steps leave smooth contours, good step coverage and high quality bevelled edges (39,40) of the thus defined conductive and resistive layers. These layers are now ready for subsequent passivation layer (42), barrier layer (44) and orifice plate (48) deposition processes to complete a thin film printhead for use in an ink jet printer.