公开(公告)号：EP0331818B1

公开(公告)日：1993-05-26

申请号：EP88121895.2

申请日：1988-12-30

Applicant: Hewlett-Packard Company

Inventor： Mackonic, James C. ,  Lelko, Dawn Marie ,  Shugart, Steven Almon ,  Koch, James K.

IPC: H05K3/42 ,  H01R9/09

CPC classification number: H01R12/526 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10401 ,  Y10T29/49149

公开(公告)号：EP0331818A1

公开(公告)日：1989-09-13

申请号：EP88121895.2

申请日：1988-12-30

Applicant: Hewlett-Packard Company

Inventor： Mackonic, James C. ,  Lelko, Dawn Marie ,  Shugart, Steven Almon ,  Koch, James K.

IPC: H05K3/42 ,  H01R9/09

CPC classification number: H01R12/526 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10401 ,  Y10T29/49149

Abstract: A method for providing an electrical connection (via) between the top and bottom of a printed circuit board (PCB) is presented. An eyelet (10) extends through a hole (25) in the PCB. The top of the PCB has a first conductive layer (23). Around the hole the first conductive layer is shaped such that a conductive pad (24) is isolated from the rest of the first conductive layer, except that spokes of the first conductive layer extend from the conductive pad (24) to the rest of the first conductive layer (23). The eyelet is crimped such that crimped fingers or tabs (31-36) of the eyelet cause the eyelet to be mechanically retained in the hole. The tabs are curved so that the tabs do not lie flat upon the conductive pad. The bottom of the PCB is then wave soldered so that a base of the eyelet is electrically coupled to a conductive layer on the bottom of the PCB and the tabs are electrically coupled to the conductive pad.

Abstract translation: 提出一种用于提供印刷电路板（PCB）的顶部和底部之间，以（经由）电连接方法。 到达孔眼（10）通过（25）在PCB延伸。 PCB的顶部具有第一导电层（23）。 孔周围的第一导电层的形状搜索做了导电垫（24）从所述第一导电层的其余部分隔离，除了没有在第一导电层的辐条从所述导电垫（24）延伸到第一的其余部分 导电层（23）。 眼孔是卷曲的搜索没有卷曲的手指或眼孔的标签（31-36）引起的小孔被机械地保持在孔中。 翼片是弯曲的，从而没有突出部不平躺在所述导电垫。 所述PCB的底部。然后波峰焊所以没有孔眼的基座是导电地耦合到层上的PCB的底部和凸片是导电的连接到所述垫。