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    Led cooling structure
    1.
    发明公开
    Led cooling structure 审中-公开
    LED-Kühlstruktur

    公开(公告)号：EP2728975A1

    公开(公告)日：2014-05-07

    申请号：EP12191204.2

    申请日：2012-11-05

    Applicant: Yeh, Chao-Chin

    Inventor： Yeh, Chao-Chin

    IPC: H05K1/02 ,  H05K3/40

    CPC classification number: H05K1/0204 ,  H01L33/642 ,  H05K1/056 ,  H05K2201/10106 ,  H05K2201/10401 ,  H05K2201/10416 ,  H05K2201/10969

    Abstract: A LED cooling structure includes a substrate (10) having a circuit layout (11) and one or a number of thermally conductive plates (14) arranged on the top wall thereof, one or a plurality of through holes (12) cut through the opposing top and bottom walls thereof and a thermally conductive post (13) mounted in each through hole (12) and connected with the thermally conductive plates (14), and one or a number of light-emitting devices (20) mounted at the substrate (10) and electrically connected to the circuit layout (11) with the bottom side thereof kept in contact with one respective thermally conductive plate (14) for quick dissipation of heat.

    Abstract translation: LED冷却结构包括具有电路布局（11）的基板（10）和布置在其顶壁上的一个或多个导热板（14），一个或多个通孔（12）穿过相对的 安装在每个通孔（12）中并与导热板（14）连接的导热柱（13）和安装在基板上的一个或多个发光装置（20） 10）并且电连接到电路布局（11），其底侧与一个相应的导热板（14）保持接触，以便快速散热。

    LEUCHTVORRICHTUNG UND VERFAHREN ZUM KONTAKTIEREN EINER LEUCHTVORRICHTUNG
    2.
    发明公开
    LEUCHTVORRICHTUNG UND VERFAHREN ZUM KONTAKTIEREN EINER LEUCHTVORRICHTUNG 审中-公开
    发光装置和方法，用于接触的照明设备

    公开(公告)号：EP2483595A1

    公开(公告)日：2012-08-08

    申请号：EP10785381.4

    申请日：2010-11-17

    Applicant: OSRAM AG

    Inventor： KAMPFRATH, Andreas ,  STRAUSS, Steffen

    IPC: F21S4/00 ,  H05K3/32

    CPC classification number: H05K3/325 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10401 ,  H05K2203/1189 ,  H01L2924/00

    Abstract: The invention relates to a lighting device (1) comprising a printed circuit board (2), wherein the printed circuit board (2) comprises wiring on the front side (3) and/or back side (5) thereof, each wiring (7) being covered by at least one potting layer (8), the lighting device (1) further comprising at least one electrically conductive punched bushing (12) and the punched bushing (12) extending through a potting layer (8) at least to the wiring and contacting the wiring. The method serves for contacting a lighting device (1) comprising a printed circuit board (2), wherein the printed circuit board (2) comprises wiring on the front side (3) and/or back side (5) thereof, each wiring being covered by at least one potting layer (8), wherein the method comprises at least the following step of: pressing an electrically conductive punched bushing (12) through the potting layer (8) to the a wiring, such that the punched bushing (12) contacts the wiring.

    Hollow contact for solder connection
    3.
    发明公开
    Hollow contact for solder connection 审中-公开
    Kontakt-Hohlelement einerLötsverbindung

    公开(公告)号：EP0931617A1

    公开(公告)日：1999-07-28

    申请号：EP99300461.3

    申请日：1999-01-21

    Applicant: THE WHITAKER CORPORATION

    Inventor： Martin, Ralph S.

    IPC: B23K1/00 ,  H01R4/02

    CPC classification number: H01R12/57 ,  H01R4/024 ,  H01R4/026 ,  H05K3/34 ,  H05K3/3447 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/10962 ,  H05K2203/1189

    Abstract: An electrical contact for making a soldered connection between an insulated wire conductor (30) and a circuit board (40). The contact includes a tubular contact body (10) having a hollow interior (18). One end (24) of the contact body (10) has an insulation piercing edge (26) which promotes penetration of the contact body (10) through insulation (34) of the wire conductor (30) and into its conductive core (32) when the wire conductor (30) is pressed against the edge (26) of the contact body (10). The other end (22) of the contact body (10) is solderable to the circuit board (40). The hollow interior permits solder (50) to be drawn by capillary action through the contact body (10) and into the conductive core (32) of the wire (26). The hollow interior (18) may be coated with solder for use in establishing the soldered connection.

    Abstract translation: 一种用于在绝缘电线导体（30）和电路板（40）之间进行焊接连接的电接点。 触点包括具有中空内部（18）的管状接触体（10）。 接触体（10）的一端（24）具有绝缘穿刺边缘（26），其促进接触体（10）穿过线导体（30）的绝缘体（34）并进入其导电芯（32）中， 当电线导体（30）被压靠在接触体（10）的边缘（26）上时。 接触体（10）的另一端（22）可焊接到电路板（40）。 中空内部允许焊料（50）通过毛细管作用被拉伸通过接触体（10）并进入导线（26）的导电芯（32）。 中空的内部（18）可以涂覆有用于建立焊接连接的焊料。

    METHOD OF JOINING CONNECTION PLATES
    4.
    发明公开
    METHOD OF JOINING CONNECTION PLATES 失效
    方法用于连接连接板。

    公开(公告)号：EP0617850A1

    公开(公告)日：1994-10-05

    申请号：EP93900479.0

    申请日：1992-12-10

    Applicant: KATONA, Sandor

    Inventor： KATONA, Sandor

    IPC: H01R4 ,  H01R43 ,  H05K3 ,  H05K1

    CPC classification number: H01R12/69 ,  H01R4/06 ,  H01R43/0484 ,  H05K1/118 ,  H05K3/326 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10962

    Abstract: Procédé permettant de fixer des cosses de branchement à des conducteurs électriques pris dans des couches thermoisolantes ou des éléments analogues. Une plaque de contact est rivetée en place à l'endroit d'un trou traversant les couches plastiques (1, 2) et l'élément métallique (3). Selon ce procédé, la plaque (9) est rivetée en place près d'un trou (4) traversant les couches de plastique et la couche métallique (3) prise entre les deux premières à l'aide d'un rivet (6) creux. Du côté opposé, le rivet est recourbé autour d'un relèvement (8) formé à l'extrémité inférieure du trou (4), lequel a été formé au moyen d'une broche (5) de forme tronconique élevée à une température suffisamment haute, de telle sorte que le bord supérieur du trou se trouve embouti en creux pour former une surface de joint accueillant le rivet (6), la partie centrale formant un corps cylindrique creux exposant la surface métallique (7) au contact du rivet (6), tandis que la partie inférieure forme un relèvement (8) réalisant un scellement, de préférence renforcé sur son pourtour, ce qui augmente ainsi la pression de contact et assure l'étanchéité de la surface entourant la surface de contact.

    Throughput of a two-sided printed board and method for producing it
    7.
    发明公开
    Throughput of a two-sided printed board and method for producing it 失效
    Durchverbindung einer doppelseitigen Leiterplatte und Verfahren zu ihrer Herstellung。

    公开(公告)号：EP0367076A1

    公开(公告)日：1990-05-09

    申请号：EP89119740.2

    申请日：1989-10-24

    Applicant: SALORA OY

    Inventor： Anttio, Markku Ilmari ,  Suominen, Aarre Tapani

    IPC: H05K3/34 ,  H01R9/09 ,  H05K1/18 ,  H05K3/40

    CPC classification number: H01R12/58 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4046 ,  H05K2201/10363 ,  H05K2201/10401 ,  H05K2201/10651 ,  H05K2201/10916

    Abstract: The object of the description is a flexible throughput of a two-sided printed board (1), by which ruptures and electric breaks caused by the different thermal expansion properties of the materials in known throughputs are avoided, and which nevertheless allows the use of an inexpensive printed board material and of the wave soldering method. According to the invention, two holes are made into the printed board, into one of which a metal sleeve (4) is inserted. The sleeve is sur­rounded by a conductor foil (2), i.e. soldering fringe on the upper surface of the printed board. The second hole (5) is without a sleeve and comprises a conductor foil, i.e. solde­ring fringe on the lower surface of the printed board. The overshoot wire (6) is composed on the printed board so that its one arm (6a) is placed into the sleeve (4) and its other arm (6b) extends through the hole (5) below the printed board. In wave soldering, the lower surface of the printed board (1) touches the molten solder, which rises from the sleeve (4) and fixes this by soldering to the overshoot wire (6) and the up­per foil (2) and simultaneously the second arm (6b) of the wire (6) is soldered to the lower conductor foil (3).

    Abstract translation: 描述的目的是双面印刷电路板（1）的灵活的通过量，由此避免了由已知吞吐量中材料的不同热膨胀特性引起的断裂和电断裂，并且仍允许使用 廉价的印刷电路板材料和波峰焊法。 根据本发明，将两个孔制成印刷板，其中一个插入金属套筒（4）。 套筒被导体箔（2）包围，即在印刷电路板的上表面上焊接边缘。 第二孔（5）没有套筒并且包括导体箔，即印刷板的下表面上的焊接边缘。 在印刷电路板上形成过冲线（6），使得其一个臂（6a）被放置在套筒（4）中，而另一个臂（6b）延伸穿过印刷电路板下方的孔（5）。 在波峰焊接中，印刷电路板（1）的下表面接触从套管（4）上升的熔融焊料，并通过焊接将其固定到过冲丝（6）和上部箔（2）上，同时将第二 线（6）的臂（6b）被焊接到下导体箔（3）。

    GETRIEBESTEUERGERÄT FÜR EIN GETRIEBE EINES FAHRZEUGS
    9.
    发明公开
    GETRIEBESTEUERGERÄT FÜR EIN GETRIEBE EINES FAHRZEUGS 审中-公开
    用于车辆传动的传动控制单元

    公开(公告)号：EP3275294A1

    公开(公告)日：2018-01-31

    申请号：EP16702415.7

    申请日：2016-02-01

    Applicant: Robert Bosch GmbH

    Inventor： BRAUN, Holger ,  LISKOW, Uwe ,  KOWATSCH, Martin ,  WEISS, Markus

    IPC: H05K3/00 ,  H05K3/28 ,  H05K5/00 ,  F16H61/00 ,  G01D11/24

    CPC classification number: H05K5/0082 ,  F16H61/0006 ,  H05K1/147 ,  H05K1/148 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2203/1327

    Abstract: The invention relates to a gearbox control device (10) for a gearbox (44) of a vehicle, comprising: a central module (12) having a carrier plate (18), electronic components (20) arranged on said carrier plate (18) and a housing (22) for said electronic components (20), said carrier plate (18) comprising an opening (36) for receiving a securing means (34) for securing the central module (12) to said gearbox (44); at least one peripheral module (14) which carries additional electrical and/or electronic components (28) of the gearbox control device (10); and at least one flexible conductive foil (16) which connects the central module (12) to the peripheral module (14). The peripheral module (14) comprises an additional carrier plate (26) on which the additional electrical and/or electronic components (28) are arranged, the carrier plate (26) having an additional opening (36) for receiving an additional securing means (34) for securing the peripheral module (14) to the gearbox (44).

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