公开(公告)号：EP2965853B2

公开(公告)日：2020-03-25

申请号：EP14176292.2

申请日：2014-07-09

申请人： High Q Laser GmbH

发明人： Matylitsky, Victor V. ,  Hendricks, Frank

IPC分类号： B23K26/073 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40

公开(公告)号：EP2965853B1

公开(公告)日：2016-09-21

申请号：EP14176292.2

申请日：2014-07-09

申请人： High Q Laser GmbH

发明人： Matylitsky, Victor V. ,  Hendricks, Frank

IPC分类号： B23K26/073 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40

CPC分类号： B23K26/53 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0736 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

摘要： Method for processing of material by use of a pulsed laser, comprising generating a series of ultra-short laser pulses (22),directing each laser pulse (22) to the material with defined reference to a respectively assigned processing point (26) of a processing path (25), and focussing each laser pulse (22) so that respective focal points of the focussed laser pulses (22) comprise pre-defined spatial relations to a first surface (2) of the material, wherein each emitted laser pulse (22) effects a respective crack (24) within the material. According to the invention, each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of asymmetric shape and defines a main extension axis (A) as to its asymmetric extension. One major crack (24) is effected by each laser pulse (22), the major crack (12,24) having a lateral extension basically oriented according to the main extension axis (A) of the respective pulse in the focal point. Furthermore, each laser pulse (22) is emitted so that the orientation of its main extension axis (A) in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path (25) at the assigned processing point (26)

公开(公告)号：EP2965853A1

公开(公告)日：2016-01-13

申请号：EP14176292.2

申请日：2014-07-09

申请人： High Q Laser GmbH

发明人： Matylitsky, Victor V. ,  Hendricks, Frank

IPC分类号： B23K26/073 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40

CPC分类号： B23K26/53 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0736 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

摘要： Method for processing of material by use of a pulsed laser, comprising generating a series of ultra-short laser pulses (22),directing each laser pulse (22) to the material with defined reference to a respectively assigned processing point (26) of a processing path (25), and focussing each laser pulse (22) so that respective focal points of the focussed laser pulses (22) comprise pre-defined spatial relations to a first surface (2) of the material, wherein each emitted laser pulse (22) effects a respective crack (24) within the material. According to the invention, each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of asymmetric shape and defines a main extension axis (A) as to its asymmetric extension. One major crack (24) is effected by each laser pulse (22), the major crack (12,24) having a lateral extension basically oriented according to the main extension axis (A) of the respective pulse in the focal point. Furthermore, each laser pulse (22) is emitted so that the orientation of its main extension axis (A) in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path (25) at the assigned processing point (26)

摘要翻译： 一种通过使用脉冲激光来处理材料的方法，包括产生一系列超短激光脉冲（22），将每个激光脉冲（22）引导到所述材料上，所述激光脉冲定义参考分配的处理点（26） 处理路径（25），并且聚焦每个激光脉冲（22），使得聚焦的激光脉冲（22）的各个焦点包括与材料的第一表面（2）的预定的空间关系，其中每个发射的激光脉冲 22）在材料内产生相应的裂纹（24）。 根据本发明，每个激光脉冲关于其光束轮廓成形，使得由其激光脉冲在其焦点上与其传播方向垂直的横截面限定的横截面面积是不对称形状并且限定主体 延伸轴（A）对其不对称延伸。 一个主要裂纹（24）由每个激光脉冲（22）实现，主裂纹（12,24）具有根据焦点中相应脉冲的主延伸轴（A）基本取向的横向延伸。 此外，发射每个激光脉冲（22），使得其焦点中其主延伸轴线（A）的取向对应于相对于处理路径（25）的相应切线的取向的预定义取向 指定处理点（26）