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    LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
    3.
    发明公开
    LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL 审中-公开

    公开(公告)号：EP4389343A2

    公开(公告)日：2024-06-26

    申请号：EP24171415.3

    申请日：2019-12-27

    申请人： Wolfspeed, Inc.

    发明人： DONOFRIO, Matthew ,  EDMOND, John ,  GOLAKIA, Harshad

    IPC分类号： B23K101/40

    CPC分类号： B23K2103/5620180801 ,  B23K26/53 ,  B28D5/00 ,  H01L21/02005 ,  B23K26/0626 ,  B23K2101/4020180801

    摘要： A method for processing a crystalline material by supplying laser emissions focused to an initial depth within an interior of a crystalline material substrate (164), and effecting relative lateral movement between a laser and the substrate (164), to form subsurface laser damage having an initial first subsurface laser damage pattern (165') substantially centered at the initial depth within the interior. The method also including supplying laser emissions focused to a subsequent within the interior of the crystalline material, and effecting relative lateral movement between the laser and the substrate (164), to form subsurface laser damage (165") having a subsequent laser damage pattern substantially centered at the subsequent depth within the interior. The subsequent depth differs from the initial depth, the subsequent subsurface laser damage pattern is substantially registered with the initial subsurface laser damage pattern, and a vertical extent of at least a portion of the subsurface laser damage (165') of the initial subsurface laser damage pattern overlaps with a vertical extent of at least a portion of the subsurface laser damage (165") of the subsequent subsurface laser damage pattern.

    LASER PROCESSING METHOD
    8.
    发明授权
    LASER PROCESSING METHOD 有权

    公开(公告)号：EP2529875B1

    公开(公告)日：2018-08-22

    申请号：EP11736828.2

    申请日：2011-01-05

    申请人： Hamamatsu Photonics K.K.

    发明人： SAKAMOTO Takeshi

    IPC分类号： B23K26/40 ,  B23K26/00 ,  B23K26/53 ,  B23K103/00

    CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2103/50

    摘要： For modulating laser light for forming a modified region SD3 at an intermediate position between a position closer to a rear face 21 and a position closer to a front face 3 with respect to an object 1, a quality pattern J having a first brightness region extending in a direction substantially orthogonal to a line 5 and second brightness regions located on both sides of the first brightness region in the extending direction of the line 5 is used. After forming modified regions SD1, SD2 at positions closer to the rear face 21 but before forming modified regions SD4, SD5 at positions closer to the rear face 21 while using the front face 3 as a laser light entrance surface, the modified region SD3 is formed at the intermediate position by irradiation with laser light modulated according to a modulation pattern including the quality pattern J.

    METHOD AND DEVICE FOR LASER PROCESSING OF TRANSPARENT MATERIALS
    9.
    发明公开
    METHOD AND DEVICE FOR LASER PROCESSING OF TRANSPARENT MATERIALS 审中-公开

    公开(公告)号：EP3356300A1

    公开(公告)日：2018-08-08

    申请号：EP16787347.0

    申请日：2016-09-30

    申请人： UAB Altechna R&D

    发明人： MIKUTIS, Mindaugas

    IPC分类号： C03B33/02 ,  B23K26/06 ,  B23K26/073 ,  B23K26/064

    CPC分类号： B23K26/53 ,  B23K26/0006 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0652 ,  B23K26/0736 ,  B23K26/0823 ,  C03B33/0222 ,  Y02P40/57

    摘要： Invention relates to the field of lasers, particularly to laser processing of transparent materials and can be used for cutting, breaking and other kind of processing of transparent materials, such as glass, chemically strengthened glass, sapphire and other crystalline materials, employing ultrashort pulse asymmetric Gauss-Bessel intensity profile laser beam. Gaussian intensity profile ultrashort pulse laser beam is transformed to asymmetric Gauss-Bessel intensity profile laser beam by inserting an optical element in Gaussian or Gauss-Bessel intensity profile laser beam path. Asymmetry of Gauss-Bessel intensity profile laser beam is set by selecting appropriate material of the optical element and/or parameters of the optical element and/or position of the optical element in the op tical beam path in such a manner, that Gauss-Bessel intensity profile laser beam, localized in the workpiece, has an elongated shape in the propagation direction of the laser beam and in the plane, perpendicular to the direction of propagation of said laser beam and induces correspondingly elongated shape damage region in the workpiece. Controlled displacement of the workpiece and the laser beam in respect to each other is performed to create a required number of additional elongated shape damage regions and to arrange them in the workpiece longitudinally one after other along the predefined trajectory forming the cutting and/or breaking plane of the workpiece.

    VERFAHREN UND VORRICHTUNG ZUM LASERGESTÜTZTEN ABTRENNEN EINES TEILSTÜCKS VON EINEM FLÄCHIGEN GLASELEMENT
    10.
    发明公开
    VERFAHREN UND VORRICHTUNG ZUM LASERGESTÜTZTEN ABTRENNEN EINES TEILSTÜCKS VON EINEM FLÄCHIGEN GLASELEMENT 有权

    公开(公告)号：EP3322675A1

    公开(公告)日：2018-05-23

    申请号：EP16736133.6

    申请日：2016-07-06

    申请人： Schott AG

    发明人： WAGNER, Fabian ,  ORTNER, Andreas ,  SEIDL, Albrecht ,  LENTES, Frank-Thomas ,  GERBAN, Jörn ,  SCHMITT, Simon

    IPC分类号： C03B33/02 ,  B23K26/00 ,  C03B33/04 ,  C03B33/09 ,  B23K26/53 ,  B23K103/00

    CPC分类号： C03B33/091 ,  B23K26/53 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/04

    摘要： A method is provided for detaching a section (4) from a planar glass element (2) along an intended parting line (21) which divides the glass element (2) into a section (4) to be detached and a main part (3) to be left, wherein - filamentary damaged portions (20) are created in the volume of the glass element (2) alongside one another along the parting line (21), and - the damaged portions (20) are created by laser pulses (12) of an ultrashort pulse laser (10), wherein the material of the glass element (2) is transparent to the laser pulses (12), and - the laser pulses (12) create a plasma in the volume of the glass element (2), said plasma causing the filamentary damaged portions (20), and - the striking points (13) of the laser pulses (12) on the glass element (2) are moved over the surface (22) thereof along the parting line (21), and - after the introduction of the filamentary damaged portions (20) arranged alongside one another along the parting line (21), the glass element (2) is heated in the region of the main part (3) and made to expand and/or is cooled in the region of the section (4) and made to contract, such that the section (4) detaches from the main part (3) along the parting line (21) at the filamentary damaged portions (20) located alongside one another, wherein the section (4) and the main part (3) are each retained as whole parts.