公开(公告)号：EP4304305A1

公开(公告)日：2024-01-10

申请号：EP21930915.0

申请日：2021-03-19

申请人： Huawei Technologies Co., Ltd.

发明人： GAN, Liyun ,  ZENG, Le ,  LIU, Zhiyu ,  MA, Zhifeng ,  ZHANG, Tong

IPC分类号： H05K3/34 ,  H05K1/18 ,  H01L23/488

摘要： Embodiments of this application disclose a packaging assembly and an electronic device. The packaging assembly includes: a substrate and a chip, where the substrate includes a first surface and a second surface that are opposite to each other, the first surface of the substrate is opposite to a surface of the chip, a plurality of electrodes are disposed on the first surface of the substrate, a signal transmission port is disposed on the second surface of the substrate, and the signal transmission port is electrically connected to the electrode; and a plurality of pads are disposed on the surface of the chip opposite to the substrate, and the pads are soldered and connected to the electrodes through a plurality of conductive connection portions, where one pad is connected to the plurality of conductive connection portions, and the plurality of conductive connection portions are electrically connected to one signal transmission port. Therefore, the plurality of conductive connection portions are disposed on a single pad, so that stress may be evenly distributed to the plurality of conductive connection portions. This improves reliability of a component. In addition, the plurality of conductive connection portions connected to one pad back up each other's performance. This provides a plurality of performance guarantees, and improves electrical connection stability.