公开(公告)号：EP4498764A1

公开(公告)日：2025-01-29

申请号：EP23830245.9

申请日：2023-06-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： ZHANG, Tong ,  JIANG, Fan ,  WEI, Dan ,  SHI, Lin

IPC: H05K1/11 ,  H05K3/00

Abstract: This application discloses a flexible printed circuit, a circuit board assembly, and an electronic device. The flexible printed circuit includes a bending portion and a soldering portion connected to the bending portion. The flexible printed circuit includes a plurality of conductive layers and a plurality of insulation layers, and the insulation layer is disposed between two adjacent conductive layers. The plurality of conductive layers include a first soldering layer, a second soldering layer, and a trace layer. Both the first soldering layer and the second soldering layer are located in the soldering portion. The first soldering layer is one surface layer of the soldering portion, and the first soldering layer is formed by a plurality of first pads that are spaced from each other. The second soldering layer is the other surface layer of the soldering portion, and the second soldering layer is formed by a plurality of second pads that are spaced from each other. The trace layer is located between the first soldering layer and the second soldering layer, and extends from the soldering portion to the bending portion. The first pad and the second pad are connected by using a through hole conductor, and are connected to the trace layer. A pad spacing in the soldering portion of the flexible printed circuit is relatively small, so that a surface area of the soldering portion can be reduced, facilitating miniaturization.

公开(公告)号：EP3919968A1

公开(公告)日：2021-12-08

申请号：EP20778902.5

申请日：2020-03-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： ZHOU, Guoming ,  YUAN, Qiyun ,  ZHANG, Tong

IPC: G02C11/00

Abstract: This application discloses a pair of glasses (210) having a wireless charging receiver circuit (610), a glasses case (310) for glasses (210), and a system, and relates to the field of terminal technologies. The glasses (210) may automatically perform hardware reset without disposing a reset button. The glasses case (310) includes a housing having a cavity configured to accommodate the glasses (210), a processor (520), and a wireless charging transmitter circuit (510) coupled to the wireless charging receiver circuit (610). The processor (520) is configured to determine that the glasses (210) need to perform power-on reset; and the wireless charging transmitter circuit (510) is configured to send a first signal to the glasses (210) in response to a case in which the processor (520) determines that the glasses (210) need to perform power-on reset, to trigger at least one processor (630) of the glasses (210) to perform power-on reset.

公开(公告)号：EP4304305A1

公开(公告)日：2024-01-10

申请号：EP21930915.0

申请日：2021-03-19

Applicant: Huawei Technologies Co., Ltd.

Inventor： GAN, Liyun ,  ZENG, Le ,  LIU, Zhiyu ,  MA, Zhifeng ,  ZHANG, Tong

IPC: H05K3/34 ,  H05K1/18 ,  H01L23/488

Abstract: Embodiments of this application disclose a packaging assembly and an electronic device. The packaging assembly includes: a substrate and a chip, where the substrate includes a first surface and a second surface that are opposite to each other, the first surface of the substrate is opposite to a surface of the chip, a plurality of electrodes are disposed on the first surface of the substrate, a signal transmission port is disposed on the second surface of the substrate, and the signal transmission port is electrically connected to the electrode; and a plurality of pads are disposed on the surface of the chip opposite to the substrate, and the pads are soldered and connected to the electrodes through a plurality of conductive connection portions, where one pad is connected to the plurality of conductive connection portions, and the plurality of conductive connection portions are electrically connected to one signal transmission port. Therefore, the plurality of conductive connection portions are disposed on a single pad, so that stress may be evenly distributed to the plurality of conductive connection portions. This improves reliability of a component. In addition, the plurality of conductive connection portions connected to one pad back up each other's performance. This provides a plurality of performance guarantees, and improves electrical connection stability.

公开(公告)号：EP4436321A1

公开(公告)日：2024-09-25

申请号：EP22914059.5

申请日：2022-12-05

Applicant: Huawei Technologies Co., Ltd.

Inventor： ZHANG, Tong ,  JIANG, Fan ,  TANG, Heyujia ,  ZHOU, Haisheng ,  WEI, Dan ,  LI, Kelin ,  LI, Jiguang ,  WANG, Hao

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K1/02 ,  H05K1/11

Abstract: This application provides a circuit board assembly and an electronic device, where the circuit board assembly includes a first circuit board and a second circuit board. The first circuit board is a flexible printed circuit, and a stiffener and one or more first pads are disposed on a first surface of the first circuit board. The stiffener is provided with first through holes, at least one first pad is located in the first through hole, and hardness of the stiffener is greater than hardness of the first circuit board. In addition, second pads are disposed on the second circuit board, and the at least one first pad is soldered to the second pad, to implement an electrical connection between the first circuit board and the second circuit board. The stiffener with large hardness is disposed, by using the circuit board assembly provided in this application, on the first circuit board, which can help improve structural strength and flatness of a region that is of the first circuit board and in which the stiffener is disposed. In this way, reliability of soldering between the first pads and the second pads can be improved, so that reliability of the connection between the first circuit board and the second circuit board is improved.