公开(公告)号：EP3248306B1

公开(公告)日：2019-03-13

申请号：EP16739774.4

申请日：2016-01-19

申请人： Huawei Technologies Co. Ltd.

发明人： CHEN, Morgan ,  XU, Qianfan ,  LEE, Hungyi ,  GU, Yifan ,  GU, Liang ,  DANG, Yen ,  LEI, Gong ,  CAO, Yuming ,  SHEN, Xiao ,  BAI, Yu Sheng

IPC分类号： H04B10/548 ,  H04B10/54

公开(公告)号：EP3292632A1

公开(公告)日：2018-03-14

申请号：EP16799200.7

申请日：2016-05-05

申请人： Huawei Technologies Co., Ltd.

发明人： CHEN, Morgan ,  GU, Yifan ,  LEE, HungYi ,  GU, Liang ,  DANG, Yen ,  LEI, Gong ,  CAO, Yuming ,  SHEN, Xiao Andy ,  BAI, YuSheng

IPC分类号： H03K5/00

CPC分类号： G02F1/2255 ,  G02F2001/212 ,  H03K5/134

摘要： An electronic driver circuit for use with a modulator such as a segmented Mach-Zehnder Modulator (MZM) is provided. The electronic driver circuit includes a first delay buffer implemented as a first complementary metal-oxide-semiconductor (CMOS) inverter and a second delay buffer implemented as a second CMOS inverter. The second CMOS inverter follows the first CMOS inverter and has a second gate width smaller than a first gate width of the first CMOS inverter. The first CMOS inverter is configured to produce a first delayed electrical signal from a received electrical signal and the second CMOS inverter is configured to produce a second delayed electrical signal from the first delayed electrical signal produced by the first CMOS inverter.

公开(公告)号：EP3549263A1

公开(公告)日：2019-10-09

申请号：EP17883350.5

申请日：2017-12-19

申请人： Huawei Technologies Co., Ltd.

发明人： GU, Liang ,  CAO, Yuming ,  DANG, Yen ,  LEI, Gong ,  GU, Yifan ,  LEE, Hung-Yi ,  DESHPANDE, Mamatha ,  SHIH, Shou-Po ,  LIU, Miao ,  LEI, Gong

IPC分类号： H03L7/00

公开(公告)号：EP3381138A1

公开(公告)日：2018-10-03

申请号：EP16874845.7

申请日：2016-12-14

申请人： Huawei Technologies Co., Ltd.

发明人： GU, Liang ,  CAO, Yuming ,  GU, Yifan ,  LEE, Hungyi ,  LEI, Gong ,  DANG, Yen ,  DESHPANDE, Mamatha ,  SHIH, Shou-Po ,  DUAN, Yan

IPC分类号： H04B10/075

CPC分类号： H04B10/0775 ,  H04B10/5055 ,  H04B10/516 ,  H04B10/564 ,  H04B10/588 ,  H04L27/01

摘要： An apparatus comprising a semiconductor chip that comprises an optical modulator configured to modulate an optical signal based on a received driver signal, a voltage-mode (VM) driver coupled to the optical modulator and configured to produce a level-shifted driver signal to modulate the optical signal, and a two-stage test interface coupled to the optical modulator and configured to receive and test the level shifted driver signal. The two-stage test interface comprises a voltage equalization stage coupled to an output-terminated buffer stage, the VM driver comprises a two-stage VM Mach-Zehnder modulator (MZM) driver that comprises a pre-driver coupled to a VM level-shifter (VMLS). The apparatus further comprises a resistor coupled to an output of the buffer stage, wherein the resistor comprises an amount of resistance that matches a termination resistance of a test equipment. The termination resistance is about 50 ohm (Ω).

公开(公告)号：EP3248306A1

公开(公告)日：2017-11-29

申请号：EP16739774.4

申请日：2016-01-19

申请人： Huawei Technologies Co. Ltd.

发明人： CHEN, Morgan ,  XU, Qianfan ,  LEE, Hungyi ,  GU, Yifan ,  GU, Liang ,  DANG, Yen ,  LEI, Gong ,  CAO, Yuming ,  SHEN, Xiao ,  BAI, Yu Sheng

IPC分类号： H04B10/548

CPC分类号： H04L27/362 ,  H04B10/5053 ,  H04B10/541 ,  H04B10/5561

摘要： An apparatus comprising a first electrical driver configured to generate a first binary voltage signal according to first data, a second electrical driver configured to generate a second binary voltage signal according to second data, wherein the first data and the second data are different, and a first optical waveguide arm coupled to the first electrical driver and the second electrical driver, wherein the first optical waveguide arm is configured to shift a first phase of a first optical signal propagating along the first optical waveguide arm according to a first voltage difference between the first binary voltage signal and the second binary voltage signal to produce a first multi-level phase-shifted optical signal.