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公开(公告)号:EP4353017A1
公开(公告)日:2024-04-17
申请号:EP22815097.5
申请日:2022-05-24
CPC分类号: H04W84/12 , H04W8/26 , H04L61/5038 , H04L2101/62220220501
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公开(公告)号:EP4294064A1
公开(公告)日:2023-12-20
申请号:EP22770300.6
申请日:2022-03-02
摘要: This application provides a direct link addressing method and apparatus, so that direct communication can be performed between a non-AP MLD and a non-AP MLD, or between a STA device and a non-AP MLD, thereby improving data transmission efficiency. This application may be applied to a Wi-Fi system. The method is applied to a first device, and the first device includes one or more stations STAs. The first device is connected to a third device, and the third device includes a plurality of access points APs. A second device is connected to the third device, and the second device includes a plurality of STAs. When the first device includes one STA, protected data is constructed by using an address of the first device, an address of the second device, and an address of a first AP connected to the first device. When the first device includes a plurality of STAs, protected data is constructed by using an address of the first device, an address of the second device, and an address of the third device. Therefore, the first device may transmit a first data unit over a direct link between the first device and the second device, thereby increasing a data transmission rate.
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公开(公告)号:EP4302453A1
公开(公告)日:2024-01-10
申请号:EP22766202.0
申请日:2022-03-02
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公开(公告)号:EP4458035A1
公开(公告)日:2024-11-06
申请号:EP23755806.9
申请日:2023-02-15
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公开(公告)号:EP4454348A1
公开(公告)日:2024-10-30
申请号:EP23739991.0
申请日:2023-01-09
发明人: MONTEMURRO, Michael , MCCANN, Stephen , SUN, Sheng
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公开(公告)号:EP4399830A1
公开(公告)日:2024-07-17
申请号:EP22875123.6
申请日:2022-09-29
发明人: MONTEMURRO, Michael , SUH, Jung Hoon , ABOUL-MAGD, Osama , MCCANN, Stephen , XIN, Yan , AU, Kwok Shum
IPC分类号: H04L5/00
CPC分类号: H04B7/0626 , H04B7/0643
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公开(公告)号:EP4292314A1
公开(公告)日:2023-12-20
申请号:EP22762635.5
申请日:2022-03-04
发明人: MCCANN, Stephen , MONTEMURRO, Michael , SUN, Sheng
IPC分类号: H04W8/22
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公开(公告)号:EP4278705A1
公开(公告)日:2023-11-22
申请号:EP22700508.9
申请日:2022-01-20
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