公开(公告)号：EP3905871A1

公开(公告)日：2021-11-03

申请号：EP20759070.4

申请日：2020-02-17

申请人： Huawei Technologies Co., Ltd.

发明人： WANG, Huijuan ,  CAI, Jinsen ,  HU, Bin ,  KONG, Bo ,  ZHAO, Tian

IPC分类号： H05K9/00

摘要： This application provides a shielding structure for a system-in-package and an electronic device. The shielding structure for a system-in-package includes a substrate, where at least two stacked first ground planes are disposed in the substrate, and a second ground plane is disposed on a surface of the substrate; and a ground pad arranged along an edge of the substrate is disposed on the second ground plane. In addition, ground holes that electrically connect the adjacent ground planes are disposed in the substrate, the ground holes are arranged in a ring around a board body, and a spacing between the adjacent ground holes is less than a specified distance, so that the ground holes can form a good Faraday cage. A device is disposed on the other surface of the substrate, and a package layer that packages the device is further disposed on the device. The shielding structure for a system-in-package further includes a shield layer that wraps the package layer, and the shield layer extends to the substrate and is electrically connected to the first ground plane. In the foregoing solutions, a ground resistance is reduced by using the disposed ground hole, to improve an electromagnetic shielding effect of the shield layer; and electromagnetic interference at a bottom of the substrate is avoided by using the disposed second ground plane and the disposed ground pad, to improve a shielding effect.