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1.发明公开
公开(公告)号：EP3713041A1
公开(公告)日：2020-09-23
申请号：EP18879518.1
申请日：2018-11-20
发明人： PEI, Changsheng , ZHU, Yongfa , YANG, Heqian , CAI, Jinsen
摘要： This application provides a coil. The coil includes an output terminal, an input terminal, and a wire-winding part that is connected between the output terminal and the input terminal. A slot is disposed on at least a part of the wire-winding part, and a depth of the slot in any direction of a cross section of the wire-winding part is less than or equal to a distance between two points that are the farthest away from each other on the cross section of the wire-winding part. The wire-winding part is a metal conductor that is made through spiral winding. The input terminal and the output terminal are configured to connect the wire-winding part to an external circuit.
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公开(公告)号：EP4243267A1
公开(公告)日：2023-09-13
申请号：EP21896345.2
申请日：2021-07-19
发明人： ZHU, Yongfa , ZENG, Zhiqiang , CAI, Jinsen , YANG, Heqian , CHEN, Xiaowei , DING, Tao
IPC分类号： H02M3/158
摘要： This application provides a conversion circuit, a switching power supply, and an electronic device. The conversion circuit mainly includes a first branch circuit and a second branch circuit. Input sides of the first branch circuit and the second branch circuit are connected in series, and output sides of the first branch circuit and the second branch circuit are connected in parallel; or input sides of the first branch circuit and the second branch circuit are connected in parallel, and output sides of the first branch circuit and the second branch circuit are connected in series. This implementation helps improve efficiency of the conversion circuit. When an inductor is disposed in the conversion circuit, a size of the inductor is further reduced, to improve integration.
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公开(公告)号：EP3905871A1
公开(公告)日：2021-11-03
申请号：EP20759070.4
申请日：2020-02-17
发明人： WANG, Huijuan , CAI, Jinsen , HU, Bin , KONG, Bo , ZHAO, Tian
IPC分类号： H05K9/00
摘要： This application provides a shielding structure for a system-in-package and an electronic device. The shielding structure for a system-in-package includes a substrate, where at least two stacked first ground planes are disposed in the substrate, and a second ground plane is disposed on a surface of the substrate; and a ground pad arranged along an edge of the substrate is disposed on the second ground plane. In addition, ground holes that electrically connect the adjacent ground planes are disposed in the substrate, the ground holes are arranged in a ring around a board body, and a spacing between the adjacent ground holes is less than a specified distance, so that the ground holes can form a good Faraday cage. A device is disposed on the other surface of the substrate, and a package layer that packages the device is further disposed on the device. The shielding structure for a system-in-package further includes a shield layer that wraps the package layer, and the shield layer extends to the substrate and is electrically connected to the first ground plane. In the foregoing solutions, a ground resistance is reduced by using the disposed ground hole, to improve an electromagnetic shielding effect of the shield layer; and electromagnetic interference at a bottom of the substrate is avoided by using the disposed second ground plane and the disposed ground pad, to improve a shielding effect.
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