摘要:
Diffusion of p-type Be dopant out of the base (40) of an npn heterojunction bipolar transistor (HBT) during the transistor fabrication is prevented by growing the base (40) at a low temperature, generally within the range of about 280°-420°C for a AlInAs/GaInAs device. The DC current gain is maximized by growing the base (40) at the highest permissible temperature before outdiffusion occurs, which is substantially above the Be precipitation temperature.
摘要:
Diffusion of p-type Be dopant out of the base (40) of an npn heterojunction bipolar transistor (HBT) during the transistor fabrication is prevented by growing the base (40) at a low temperature, generally within the range of about 280°-420°C for a AlInAs/GaInAs device. The DC current gain is maximized by growing the base (40) at the highest permissible temperature before outdiffusion occurs, which is substantially above the Be precipitation temperature.