公开(公告)号：EP2814802A1

公开(公告)日：2014-12-24

申请号：EP13749272.4

申请日：2013-02-07

申请人： Huntsman Advanced Materials Americas LLC

发明人： WANG, Dong ,  KINCAID, Derek ,  KUANG, Wenfeng ,  SUBRAHMANIAN, K. P. ,  ARGUELLES, Leo

IPC分类号： C07C39/12 ,  C07C39/23 ,  C08L63/00 ,  C08G59/16

CPC分类号： C08L79/02 ,  C08G59/4014 ,  C08G59/42 ,  C08L63/00 ,  C09D163/00 ,  C09D179/02 ,  C08L79/04

摘要： The present disclosure provides a phenolic-free composition containing a benzoxazine, epoxy resin and acid anhydride. The phenolic-free composition, upon curing, renders void free cured articles having well balanced thermal, chemical and mechanical properties. The phenolic- free composition may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.

公开(公告)号：EP3924413A1

公开(公告)日：2021-12-22

申请号：EP19909618.1

申请日：2019-02-14

申请人： Huntsman Advanced Materials Americas LLC

发明人： KUANG, Wenfeng ,  XIE, Rui ,  TREVINO, Jose III

IPC分类号： C08K5/49 ,  C08G59/50