摘要:
The present disclosure provides a curable composition containing a benzoxazine, reactive diluent and a soluble polyimide. The curable composition, upon curing, renders an article having well balanced thermal, chemical and mechanical properties and may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.
摘要:
The present disclosure provides a phenolic-free composition containing a benzoxazine, epoxy resin and acid anhydride. The phenolic-free composition, upon curing, renders void free cured articles having well balanced thermal, chemical and mechanical properties. The phenolic- free composition may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.
摘要:
The present disclosure provides a curable composition containing a benzoxazine and a polysulfone-based toughener. The curable composition, upon curing, renders a cured article having well balanced thermal, chemical and mechanical properties, The curable composition may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.
摘要:
The present disclosure relates to UV resistant multi-component structural adhesive systems that are substantially free of aromatic epoxy resins, Also provided are methods of preparing the multi-component structural adhesive systems and methods of bonding substrates together with such adhesive systems.