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公开(公告)号：EP3410929A1
公开(公告)日：2018-12-12
申请号：EP17748271.8
申请日：2017-02-03
发明人： DAVIS, Michael W. , LADWIG, Peter F. , LANG, Matthew S. , MYERS, Dean E. , OLSEN, Clark T. , RIEMER, Douglas P.
IPC分类号： A61B5/0215 , A61B5/03 , G01L7/08 , G01L9/12
CPC分类号： G01L1/2268 , G01L1/146
摘要： A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace. In embodiments the sensing element includes electrodes. In other embodiments the sensing element includes a strain gauge.
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公开(公告)号：EP3265678B1
公开(公告)日：2020-08-19
申请号：EP16762309.9
申请日：2016-03-07
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3.发明公开
公开(公告)号：EP3265678A1
公开(公告)日：2018-01-10
申请号：EP16762309.9
申请日：2016-03-07
发明人： LADWIG, Peter F. , MILLER, Mark A. , DAVIS, Michael W. , SCHEELE, Bryan J. , RIEMER, Douglas P. , ANDERSON, Donald M. , THEGET, John A.
摘要： Embodiments of the invention include a camera lens optical image stabilization suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members. The moving member includes flexure arms that have integrated conductive traces.
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公开(公告)号：EP3847706A1
公开(公告)日：2021-07-14
申请号：EP19858176.1
申请日：2019-09-04
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公开(公告)号：EP3368240A1
公开(公告)日：2018-09-05
申请号：EP16860703.4
申请日：2016-10-26
发明人： DAVIS, Michael W. , RIEMER, Douglas P. , OLSEN, Clark T. , LAGERGREN, Steven R. , PESAVENTO, Paul V.
CPC分类号： B23K20/10 , B23K1/0008 , B23K1/19 , B23K20/023 , B23K20/233 , B23K2101/35 , B23K2103/08 , B23K2103/172 , B23K2103/42 , B23K2103/52 , C23C14/185 , C23C14/205 , C23C18/1641 , C23C18/1689 , C23C18/1851 , C23C18/2006 , C23C18/32 , C23C18/42 , C25D3/04 , C25D3/48 , C25D5/48 , C25D5/56 , C25D7/00
摘要： A method of manufacture includes forming a metallized tie layer on a surface of a non-metallic component, positioning the surface of the non-metallic component to mate with a metallic surface of a second component, and joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.
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