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1.发明公开STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR INTEGRATED CIRCUITS 审中-公开FOR形成电吹金属结构，方法保险丝集成电路
公开(公告)号：EP2433303A4
公开(公告)日：2014-09-17
申请号：EP09845033
申请日：2009-05-22
Applicant: IBM
Inventor： FILIPPI RONALD , STANDAERT THEODORUS E , GRUNOW STEPHAN , SANKARAN SUJATHA , CHANDA KAUSHIK , GAMBINO JEFFREY P , SIMON ANDREW H , HU CHAO-KUN , BONILLA GRISELDA
IPC: H01L23/525
CPC classification number: H01L23/5256 , H01L2924/0002 , H01L2924/00
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