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1.发明公开DIELECTRIC CAP HAVING MATERIAL WITH OPTICAL BAND GAP TO SUBSTANTIALLY BLOCK UV RADIATION DURING CURING TREATMENT, AND RELATED METHODS 审中-公开与光学带隙的材料的介电CLOSURE基本上LOCKED对UV辐射硬化及相关过程期间
公开(公告)号：EP2111637A4
公开(公告)日：2012-08-08
申请号：EP08728172
申请日：2008-01-24
Applicant: IBM
Inventor： BELYANSKY MICHAEL P , BONILLA GRISELDA , LIU XIAO HU , NGUYEN SON VAN , SHAW THOMAS M , SHOBHA HOSADURGA K , YANG DAEWON
IPC: H01L23/12 , H01L21/3105 , H01L21/318 , H01L21/768
CPC classification number: H01L21/02123 , H01L21/02126 , H01L21/02167 , H01L21/0217 , H01L21/02274 , H01L21/02348 , H01L21/318 , H01L21/3185 , H01L21/76826 , H01L21/76828 , H01L21/76834
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2.发明公开STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR INTEGRATED CIRCUITS 审中-公开FOR形成电吹金属结构，方法保险丝集成电路
公开(公告)号：EP2433303A4
公开(公告)日：2014-09-17
申请号：EP09845033
申请日：2009-05-22
Applicant: IBM
Inventor： FILIPPI RONALD , STANDAERT THEODORUS E , GRUNOW STEPHAN , SANKARAN SUJATHA , CHANDA KAUSHIK , GAMBINO JEFFREY P , SIMON ANDREW H , HU CHAO-KUN , BONILLA GRISELDA
IPC: H01L23/525
CPC classification number: H01L23/5256 , H01L2924/0002 , H01L2924/00
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