Patent search ap:("IBM") AND inv:"HEABERLIN DOUGLAS C" Page 1

1.

发明公开
EXHAUSTIVE DIAGNOSIS OF BRIDGING DEFECTS IN AN INTEGRATED CIRCUIT 审中-公开
Title translation: 桥接缺陷的集成电路中的综合诊断

公开(公告)号：EP2035979A4

公开(公告)日：2011-04-13

申请号：EP07798506

申请日：2007-06-13

Applicant: IBM

Inventor： HEABERLIN DOUGLAS C

IPC: G01R31/30 , G01R31/28

CPC classification number: G01R31/2853 , G01R31/3008

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