HARD MASK STRUCTURE FOR PATTERNING OF MATERIALS
    2.
    发明公开
    HARD MASK STRUCTURE FOR PATTERNING OF MATERIALS 审中-公开
    HART罩结构用于结构材料的

    公开(公告)号:EP1908094A4

    公开(公告)日:2009-02-11

    申请号:EP05853232

    申请日:2005-12-07

    Applicant: IBM

    Abstract: Techniques for magnetic device (302) fabrication are provided. In one aspect, a method of patterning at least one, e.g., nonvolatile, material comprises the following steps. A hard mask structure (315), comprising thin hard mask layer (316) and thick hard mask layer (318) is formed on at least one surface of the material to be patterned. The hard mask structure is configured to have a base, proximate to the material, and a top opposite the base. The base has one~ or more lateral dimensions that are greater than one or more lateral dimensions of the top of the hard mask structure, such that at least one portion of the base extends out laterally a substantial distance beyond the top. The top of the hard mask structure is at a greater vertical distance from the material being etched than the base. The material is etched.

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