公开(公告)号：EP4009387A1

公开(公告)日：2022-06-08

申请号：EP20212122.4

申请日：2020-12-07

申请人： IQM Finland Oy

发明人： Li, Tianyi ,  Liu, Wei ,  Venkatesh, Manjunath Ramachandrappa ,  Ahmad, Hasnain ,  Chan, Kok Wai ,  Tan, Kuan Yen

IPC分类号： H01L39/24 ,  B82Y10/00 ,  G06N10/00

摘要： The present invention relates to the manufacture of Josephson junctions (51, 52). Such Josephson junctions may be suitable for use in qubits. High-quality, potentially monocrystalline, electrode and dielectric layers are formed using blanket deposition and subsequently the structure of one of more Josephson junctions is formed using multi-photon lithography to create openings in a resist followed by etching the electrode and dielectric layers.

公开(公告)号：EP3933716A1

公开(公告)日：2022-01-05

申请号：EP20183079.1

申请日：2020-06-30

申请人： IQM Finland Oy

发明人： Li, Tianyi ,  Chan, Kok Wai ,  Tan, Kuan Yen ,  Goetz, Jan ,  Möttönen, Mikko

IPC分类号： G06N10/00

摘要： For resetting qubits there are one or more quantum circuit refrigerators, each comprising a tunneling junction and a control input for receiving a control signal. Photon-assisted single-electron tunneling takes place across the respective tunneling junction in response to a control signal. Capacitive or inductive coupling elements between the qubits and the quantum circuit refrigerators couple each qubit to the quantum circuit refrigerator(s). The qubits, quantum circuit refrigerators, and coupling elements are in a cryogenically cooled environment. A common control signal line to the control inputs crosses into said cryogenically cooled environment from a room temperature environment.

公开(公告)号：EP4002227A1

公开(公告)日：2022-05-25

申请号：EP20209130.2

申请日：2020-11-23

申请人： IQM Finland Oy

发明人： Ockeloen-Korppi, Caspar ,  Li, Tianyi ,  Liu, Wei ,  Sevriuk, Vasilii ,  Naaranoja, Tiina ,  Jenei, Mate ,  Goetz, Jan ,  Tan, Kuan Yen ,  Möttönen, Mikko ,  Chan, Kok Wai

IPC分类号： G06N10/00 ,  H01L27/06 ,  H01L39/24

摘要： A three-dimensional superconducting qubit comprises a structural base, comprising one or more insulating materials, and superconductive patterns on surfaces of said structural base. Said superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of said surfaces of said structural base defines a first plane and a second surface of said surfaces of said structural base defines a second plane, said second plane being oriented differently than said first plane. At least one superconductive pattern of said superconductive patterns extends from said first surface to said second surface.

公开(公告)号：EP3937093A1

公开(公告)日：2022-01-12

申请号：EP20185005.4

申请日：2020-07-09

申请人： IQM Finland Oy

发明人： Hassel, Juha ,  Liu, Wei ,  Sevriuk, Vasilii ,  Heinsoo, Johannes ,  Jenei, Mate ,  Venkatesh, Manjunath ,  Li, Tianyi ,  Chan, Kok Wai ,  Tan, Kuan Yen ,  Möttönen, Mikko

IPC分类号： G06N10/00 ,  H01L39/00

摘要： A quantum computing circuit comprises a first chip, with at least one qubit thereon, and a second chip, with at least other quantum circuit element than qubit thereon. Said first chip and said second chip are stacked together in a flip-chip configuration and attached to each other with bump bonding that comprises bonding bumps.