公开(公告)号：EP3937093A1

公开(公告)日：2022-01-12

申请号：EP20185005.4

申请日：2020-07-09

申请人： IQM Finland Oy

发明人： Hassel, Juha ,  Liu, Wei ,  Sevriuk, Vasilii ,  Heinsoo, Johannes ,  Jenei, Mate ,  Venkatesh, Manjunath ,  Li, Tianyi ,  Chan, Kok Wai ,  Tan, Kuan Yen ,  Möttönen, Mikko

IPC分类号： G06N10/00 ,  H01L39/00

摘要： A quantum computing circuit comprises a first chip, with at least one qubit thereon, and a second chip, with at least other quantum circuit element than qubit thereon. Said first chip and said second chip are stacked together in a flip-chip configuration and attached to each other with bump bonding that comprises bonding bumps.