REFLOW OVEN AND METHODS OF TREATING SURFACES OF THE REFLOW OVEN
    4.
    发明公开
    REFLOW OVEN AND METHODS OF TREATING SURFACES OF THE REFLOW OVEN 有权
    回流焊炉和方法处理表面回流焊炉的

    公开(公告)号:EP2834579A1

    公开(公告)日:2015-02-11

    申请号:EP13716632.8

    申请日:2013-03-28

    Abstract: A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.

    Abstract translation: 用于连接电子部件的衬底A回流焊炉包括室壳体具有表面的确是与与污染物混合加热的空气,包括焊剂接触,并且在中间层选择性地施加到所述腔室壳体的表面上。 回流炉可以包括有泡沫材料制造中间层,包含发泡聚合物,E. G.,环氧树脂,聚氨酯,聚酯,和聚硅氧烷,或具有非发泡材料,包括非发泡聚合物,E. G.,聚四氟乙烯和聚酰亚胺。 治疗回流的表面的方法烘箱暴露于污染物,包括助焊剂,是Furtherwirt游离缺失盘。

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