公开(公告)号：EP3178868B1

公开(公告)日：2018-02-14

申请号：EP16190975.9

申请日：2016-09-28

申请人： Industrial Technology Research Institute

发明人： Liu, Yen-Chun ,  Chang, Hui-Wen ,  Wang, Min-Chian ,  Chiou, Kuo-Chan

IPC分类号： C08G73/10 ,  C08G73/14 ,  C08L79/08

CPC分类号： C09K5/14 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08K3/34 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/382 ,  C08L79/08

摘要： A thermally conductive resin is provided. The thermally conductive resin has the formula . In the formula, X 1 is X 2 is or m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

公开(公告)号：EP3176198A1

公开(公告)日：2017-06-07

申请号：EP16192675.3

申请日：2016-10-06

申请人： Industrial Technology Research Institute

发明人： Liu, Yen-Chun ,  Chang, Hui-Wen ,  Tsao, Hsiang-Yen ,  Chiou, Kuo-Chan

IPC分类号： C08G59/22 ,  C08G59/50 ,  C08K3/08 ,  H01L23/373

CPC分类号： C09K5/14 ,  C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/50 ,  C08G59/5033 ,  H01L23/3737

摘要： An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4'-methylenedianiline, 4,4'-ethylenedianiline, 4,4'-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

摘要翻译： 提供了一种环氧树脂组合物。 所述环氧树脂组合物包含由式（I）表示的第一芳族环氧树脂和选自4,4'-亚甲基二苯胺，4,4'-亚乙基二苯胺，4,4'-双（4-甲基苯基） （4-氨基苯氧基）联苯和1,4-双（4-氨基苯氧基）苯，其中第一芳族环氧树脂的环氧基与氨基化合物的氨基之间的比率为1:1至2:1。

公开(公告)号：EP3178868A1

公开(公告)日：2017-06-14

申请号：EP16190975.9

申请日：2016-09-28

申请人： Industrial Technology Research Institute

发明人： Liu, Yen-Chun ,  Chang, Hui-Wen ,  Wang, Min-Chian ,  Chiou, Kuo-Chan

IPC分类号： C08G73/10 ,  C08G73/14 ,  C08L79/08

CPC分类号： C09K5/14 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08K3/34 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/382 ,  C08L79/08

摘要： A thermally conductive resin is provided. The thermally conductive resin has the formula

. In the formula, X 1 is


X 2 is



or

m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

摘要翻译： 提供导热树脂。 导热树脂具有下式。 式中，X 1为X 2或m为0〜95的整数，n为1〜50的整数，o为1〜80的整数。包含上述导热性树脂的热界面材料为 还提供。

公开(公告)号：EP3176198B1

公开(公告)日：2018-12-12

申请号：EP16192675.3

申请日：2016-10-06

申请人： Industrial Technology Research Institute

发明人： Liu, Yen-Chun ,  Chang, Hui-Wen ,  Tsao, Hsiang-Yen ,  Chiou, Kuo-Chan

IPC分类号： C08G59/22 ,  C08G59/50 ,  C09K5/14 ,  H01L23/373 ,  C08G59/24

CPC分类号： C09K5/14 ,  C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/50 ,  C08G59/5033 ,  H01L23/3737

摘要： An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4'-methylenedianiline, 4,4'-ethylenedianiline, 4,4'-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.