公开(公告)号：EP1384396B1

公开(公告)日：2006-07-05

申请号：EP02766904.3

申请日：2002-04-30

申请人： Infineon Technologies AG

发明人： BARTOLA, Robert ,  MOGEL, James ,  LAUREANTI, Steven, J.

IPC分类号： H05K1/02

CPC分类号： H05K1/0272 ,  H01L23/473 ,  H01L2224/32

摘要： A cooling system for electronic components and printed circuit boards (PCBs) provides close thermal contact of a bulk coolant circulating through channels formed inside or on the surface of a multi-layer PCB carrying the electronic components, such that heat produced by the components is efficiently removed to a heat sink. The circulation channels may be formed by removing portions of layers, and inserting overlaying vias, during manufacturing or assembly of the PCB.

公开(公告)号：EP1384396A1

公开(公告)日：2004-01-28

申请号：EP02766904.3

申请日：2002-04-30

申请人： Infineon Technologies AG

发明人： BARTOLA, Robert ,  MOGEL, James ,  LAUREANTI, Steven, J.

IPC分类号： H05K1/02

CPC分类号： H05K1/0272 ,  H01L23/473 ,  H01L2224/32

摘要： A cooling system for electronic components and printed circuit boards (PCBs) provides close thermal contact of a bulk coolant circulating through channels formed inside or on the surface of a multi-layer PCB carrying the electronic components, such that heat produced by the components is efficiently removed to a heat sink. The circulation channels may be formed by removing portions of layers, and inserting overlaying vias, during manufacturing or assembly of the PCB.