公开(公告)号：EP1073098A1

公开(公告)日：2001-01-31

申请号：EP99114787.7

申请日：1999-07-28

申请人： Infineon Technologies AG

发明人： Schneegans, Manfred, Dr. ,  Hinz, Christine ,  Mimietz, Steffen

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327

摘要： The present invention is concerned with adhesive mounting a wafer on a tape and separating or dividing the wafer after backside grinding. According the invention the tape consists of a support tape (1) and precut tapes (2) which are adhered at the support tape (1). The precut tape (2) is fixed at a frame (5) without any stress or bi-directional expanding. The wafer (3) is backside adhered on the top side of the precut tape (2).

摘要翻译： 本发明涉及将胶片安装在带上并在背面研磨之后分离或分割晶片的粘合剂。 根据本发明，胶带由支撑带（1）和预紧带（2）组成，它们粘附在支撑带（1）上。 预切带（2）固定在框架（5）处，没有任何应力或双向膨胀。 晶片（3）背面粘附在预切割带（2）的顶侧。