VERFAHREN ZUR HERSTELLUNG EINES RINGFÖRMIGEN MIKROSTRUKTURELEMENTES
    1.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINES RINGFÖRMIGEN MIKROSTRUKTURELEMENTES 有权
    用于生产环形微结构构件

    公开(公告)号:EP1554738A1

    公开(公告)日:2005-07-20

    申请号:EP03773484.5

    申请日:2003-10-02

    IPC分类号: H01F41/30 H01F41/34

    摘要: The inventive element (R) composing an annular microstructure, in particular a thin single layer or multilayer circular film is formed on a substrate (S) which is used for a magnetoresistive memory. The inventive method consists in applying a masking layer to the substrate in such a way that the surface thereof is directly covered. An aperture (C) is produced by etching the masking layer in such a way that a partial area of said surface is uncovered. The etching is carried out in such a way that the aperture (C) is formed with a raised part (B) which protects at least partially the uncovered surface of an incident particle beam (TS). Said incident particle beam (TS) is oriented towards the substrate (S) at an inclined incidence angle ($g (a)). During said procedure, the substrate (S) rotates with respect to the particle beam (TS) oriented theretowards. Material is annularly deposed on the uncovered surface from said particle beam in such a way that a perforated microstructure element is formed.

    RESISTIVE MEMORY ELEMENTS WITH REDUCED ROUGHNESS
    2.
    发明公开
    RESISTIVE MEMORY ELEMENTS WITH REDUCED ROUGHNESS 审中-公开
    具有较小粗糙度耐存储元件

    公开(公告)号:EP1466330A2

    公开(公告)日:2004-10-13

    申请号:EP03702435.3

    申请日:2003-01-14

    发明人: RABERG, Wolfgang

    IPC分类号: G11C11/16

    CPC分类号: G11C11/16

    摘要: A resistive memory element (144), magnetic random access memory (MRAM) device, and methods of manufacturing thereof, wherein a thin oxide layer (132) is disposed within the first metal layer (136) of thememory element (144). The thin oxide layer (132) comprises an oxygen mono-layer. The roughness of subsequently-formed layers (134/118/116) is reduced, and magnetic capabilities of the resistive memory element (144) are enhanced by the use of the thin oxide layer (132) within the first metal layer (136).

    VERFAHREN ZUM BESCHREIBEN MAGNETORESISTIVER SPEICHERZELLEN UND MIT DIESEM VERFAHREN BESCHREIBBARER MAGNETORESISTIVER SPEICHER
    5.
    发明公开
    VERFAHREN ZUM BESCHREIBEN MAGNETORESISTIVER SPEICHERZELLEN UND MIT DIESEM VERFAHREN BESCHREIBBARER MAGNETORESISTIVER SPEICHER 有权
    方法用于描述磁存储单元和在这个过程中写的磁阻存储器

    公开(公告)号:EP1360692A2

    公开(公告)日:2003-11-12

    申请号:EP02701239.2

    申请日:2002-01-24

    IPC分类号: G11C11/16 G11C11/15

    CPC分类号: G11C11/1675

    摘要: The invention relates to a method for writing in the magnetoresistive memory cells of a MRAM memory, wherein the write currents (IWL, IBL) are applied respectively onto a word line (WL) and a bit line (BL), a superposition of the magnetic fields generated by the write currents in each memory cell selected by the corresponding word lines and bits lines altering the direction of the magnetisation thereof. According to the inventive method, the write currents (IWL, IBL) are applied in a chronologically offset manner, to the corresponding word line (WL) and the bit line (BL) whereby the direction of magnetisation of the selected memory cell is rotated in several consecutive steps (a - h) in the desired direction for writing a logical '0' or '1'.