公开(公告)号：EP4387403A1

公开(公告)日：2024-06-19

申请号：EP22213417.3

申请日：2022-12-14

申请人： Infineon Technologies Austria AG

发明人： WONG, Jek Hoe ,  RICK, Michael

IPC分类号： H05K3/30 ,  H05K3/34

CPC分类号： H05K3/305 ,  H05K2201/203620130101 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2203/147620130101

摘要： A method of soldering a surface mount device (SMD) to an application board comprises depositing one or more first adhesive volumes onto the application board. The one or more first adhesive volumes are hardened. One or more second adhesive volumes are deposited onto the application board. The SMD is placed on the hardened one or more first adhesive volumes in contact with the one or more second adhesive volumes, wherein the SMD is supported by the hardened one or more first adhesive volumes to form a gap between the application board and the SMD. The one or more second adhesive volumes are hardened to hold the SMD to the application board. The SMD is soldered to the application board by applying molten solder in the gap between the application board and the SMD.