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    SOLDERING A SURFACE MOUNT DEVICE TO AN APPLICATION BOARD
    2.
    发明公开
    SOLDERING A SURFACE MOUNT DEVICE TO AN APPLICATION BOARD 审中-公开

    公开(公告)号：EP4387403A1

    公开(公告)日：2024-06-19

    申请号：EP22213417.3

    申请日：2022-12-14

    申请人： Infineon Technologies Austria AG

    发明人： WONG, Jek Hoe ,  RICK, Michael

    IPC分类号： H05K3/30 ,  H05K3/34

    CPC分类号： H05K3/305 ,  H05K2201/203620130101 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2203/147620130101

    摘要： A method of soldering a surface mount device (SMD) to an application board comprises depositing one or more first adhesive volumes onto the application board. The one or more first adhesive volumes are hardened. One or more second adhesive volumes are deposited onto the application board. The SMD is placed on the hardened one or more first adhesive volumes in contact with the one or more second adhesive volumes, wherein the SMD is supported by the hardened one or more first adhesive volumes to form a gap between the application board and the SMD. The one or more second adhesive volumes are hardened to hold the SMD to the application board. The SMD is soldered to the application board by applying molten solder in the gap between the application board and the SMD.

    METHOD OF PRODUCING PRINT BOARD
    3.
    发明公开
    METHOD OF PRODUCING PRINT BOARD 审中-公开

    公开(公告)号：EP4426076A2

    公开(公告)日：2024-09-04

    申请号：EP24188167.1

    申请日：2020-11-25

    申请人： Noda Screen Co., Ltd

    发明人： MORI, Yasumitsu ,  DOI, Akihiro

    IPC分类号： H05K3/00

    CPC分类号： H05K3/42 ,  H05K2203/013920130101 ,  H05K2201/095920130101 ,  H05K3/0094 ,  H05K2203/147620130101 ,  H05K2203/02520130101 ,  C09J7/20 ,  C09J2301/20420200801 ,  C09J2301/1820200801 ,  C09J2203/32620130101

    摘要： A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a filling material supplying side and separated from the print board (10) before starting a curing of the filling material (16), the sealing film (12) being made of synthetic resin and having a thickness being from 35 µm to 100 µm , the sealing film (12) comprising: a base film (12A) that has a smooth surface, the base film (12A) including micro holes (12C) having a diameter being from 10 µm to 100 µm and arranged at intervals of 2 mm to 4 mm; and an adhesive layer (12B) divided into adhesive layer (12B) portions that have a diameter being from 100 µm to 500 µm and are disposed on the base film at intervals of 10 µm to 400 µm.