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公开(公告)号:EP3308393A1
公开(公告)日:2018-04-18
申请号:EP16709369.9
申请日:2016-03-09
发明人: BIRKNER, Andreas , VAN LOON, Guido , EVERS, Arndt
IPC分类号: H01L21/67 , H01L21/677
CPC分类号: H01L21/6719
摘要: The invention relates to a service module, by which a conditioning module, which serves in particular for the processing of wafers, can be withdrawn from a plant.