专利检索 ap:("Intel Corporation") AND inv:"HELM, Mark" 第 1 页

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发明公开
THREE DIMENSIONAL STORAGE CELL ARRAY WITH HIGHLY DENSE AND SCALABLE WORD LINE DESIGN APPROACH 审中-公开

公开(公告)号：EP3440700A1

公开(公告)日：2019-02-13

申请号：EP17776028.7

申请日：2017-01-11

申请人： Intel Corporation

发明人： THIMMEGOWDA, Deepak , YIP, Aaron , HELM, Mark , LI, Yongna

IPC分类号： H01L27/11578 , H01L27/11575 , H01L27/1157 , H01L27/11551 , H01L27/11548 , H01L27/11524 , H01L27/11597 , H01L27/11595 , H01L27/24