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    LOW DROPOUT REGULATOR WITH HYSTERETIC CONTROL
    2.
    发明公开
    LOW DROPOUT REGULATOR WITH HYSTERETIC CONTROL 审中-公开
    REGLER MIT HYSTERESESTEUERUNG UND NIEDRIGEM SPANNUNGSVERLUST

    公开(公告)号：EP2901244A1

    公开(公告)日：2015-08-05

    申请号：EP13842842.0

    申请日：2013-06-10

    申请人： Intel Corporation

    发明人： JAIN, Rinkle ,  SHIH, Yi-Chun ,  VAIDYA, Vaibhav

    IPC分类号： G06F1/26

    CPC分类号： G05F1/56 ,  G05F1/565

    摘要： An output stage has an input supply node to receive an input power supply and an output node to provide an output supply to a load. An amplifier is used to control current strength of the output stage according to the output supply and a reference voltage. A hysteresis unit is used to monitor the output supply and operable to control the current strength of the output stage according to a voltage level of the output supply. In one embodiment, a plurality of charge pumps are used to adjust current strength of the output stage. A logic unit is used to monitor the output supply and operable to control the plurality of charge pumps according to a voltage level of the output supply and one or more reference voltages.

    摘要翻译： 输出级具有用于接收输入电源的输入电源节点和用于向负载提供输出电源的输出节点。 放大器用于根据输出电源和参考电压来控制输出级的电流强度。 滞后单元用于监控输出电源，并可根据输出电源的电压电平控制输出级的电流强度。 在一个实施例中，使用多个电荷泵来调节输出级的电流强度。 逻辑单元用于监视输出电源并且可操作以根据输出电源的电压电平和一个或多个参考电压来控制多个电荷泵。

    THROUGH-BODY-VIA ISOLATED COAXIAL CAPACITOR AND TECHNIQUES FOR FORMING SAME
    5.
    发明公开
    THROUGH-BODY-VIA ISOLATED COAXIAL CAPACITOR AND TECHNIQUES FOR FORMING SAME 审中-公开
    KÖRPERDURCHGANGSISOLIERTERKOAXIALER KONDENSATOR UND VERFAHREN ZUR HERSTELLUNG DAVON

    公开(公告)号：EP3087604A1

    公开(公告)日：2016-11-02

    申请号：EP13900035.0

    申请日：2013-12-23

    申请人： Intel Corporation

    发明人： LEE, Kevin, J. ,  SARASWAT, Ruchir ,  ZILLMANN, Uwe ,  COWLEY, Nicholas, P. ,  SCHAEFER, Andre ,  JAIN, Rinkle ,  DROEGE, Guido

    IPC分类号： H01L27/108

    CPC分类号： H01L23/5223 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/76898 ,  H01L21/8221 ,  H01L23/481 ,  H01L23/492 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L25/0657 ,  H01L27/0629 ,  H01L28/90 ,  H01L2225/06544 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Techniques are disclosed for forming a through-body-via (TBV) isolated coaxial capacitor in a semiconductor die. In some embodiments, a cylindrical capacitor provided using the disclosed techniques may include, for example, a conductive TBV surrounded by a dielectric material and an outer conductor plate. The TBV and outer plate can be formed, for example, so as to be self-aligned with one another in a coaxial arrangement, in accordance with some embodiments. The disclosed capacitor may extend through the body of a host die such that its terminals are accessible on the upper and/or lower surfaces thereof. Thus, in some cases, the host die can be electrically connected with another die to provide a die stack or other three-dimensional integrated circuit (3D IC), in accordance with some embodiments. In some instances, the disclosed capacitor can be utilized, for example, to provide integrated capacitance in a switched-capacitor voltage regulator (SCVR).

    摘要翻译： 公开了用于在半导体管芯中形成穿通体通孔（TBV）隔离同轴电容器的技术。 在一些实施例中，使用所公开的技术提供的圆柱形电容器可以包括例如由介电材料和外导体板包围的导电TBV。 根据一些实施例，TBV和外板可以形成为例如以同轴布置彼此自对准。 所公开的电容器可以延伸穿过主模具的主体，使得其端子在其上表面和/或下表面上可接近。 因此，根据一些实施例，在一些情况下，主体管芯可以与另一个管芯电连接以提供管芯堆叠或其他三维集成电路（3D IC）。 在一些情况下，所公开的电容器可以用于例如在开关电容器电压调节器（SCVR）中提供集成电容。