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公开(公告)号：EP0467118A3
公开(公告)日：1992-03-18
申请号：EP91110558.3
申请日：1991-06-26
发明人： Bard, Steven L. , Christensen, David N. , Glenning, John J. , Nicoletti, James A. , Urdanick, Mark W.
CPC分类号： C23F1/08 , B08B3/04 , H05K3/068 , H05K13/0061
摘要： A device (10) for applying fluid (e.g., etchant) to a substrate (19) (e.g., thin metallic tape) wherein the device (19) includes a head member (11) having means (13) therein for directing a first fluid (15) (e.g, etchant) at an established first pressure against the substrate (19) and means (23) for directing a second fluid (25) (e.g., air) at an established second pressure equal to or greater than the first pressure (at the location of fluid intersection) and against the substrate (19) in the area proximate the first fluid so as to substantially contain and limit the first fluid (15) to impingement substantially only at the location against which the first fluid (15) is designed to strike. Preferably, two opposing head members (11, 11') are utilized, and these may serve to maintain the substrate (19) therebetween in a suspended state. Both head members (11, 11') are movable relative to each other during fluid application. As stated, the device is particularly suited to function as an etcher, but may also serve other purposes (e.g., coating, cleaning, rinsing, etc.).
摘要翻译： 一种用于将流体（例如蚀刻剂）施加到基底（19）（例如，薄金属带）的装置（10），其中该装置（19）包括头部件（11），其中具有用于引导第一流体 在确定的第一压力下对衬底（19）施加第一压力（15）（例如蚀刻剂），以及用于以等于或大于第一压力的建立的第二压力引导第二流体（25）（例如空气）的装置（23） （在流体相交位置处）并抵靠在靠近第一流体的区域中的基底（19），以基本上容纳并限制第一流体（15）基本上仅在第一流体（15）抵靠的位置处撞击， 旨在罢工。 优选地，利用两个相对的头部构件（11,11'），并且这些头部构件可用于将衬底（19）保持在悬置状态。 在流体施加期间，两个头构件（11,11'）都可相对于彼此移动。 如上所述，该装置特别适合用作蚀刻机，但也可以用于其他目的（例如，涂覆，清洁，冲洗等）。
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公开(公告)号：EP0467118B1
公开(公告)日：1996-01-03
申请号：EP91110558.3
申请日：1991-06-26
发明人： Bard, Steven L. , Christensen, David N. , Glenning, John J. , Nicoletti, James A. , Urdanick, Mark W.
CPC分类号： C23F1/08 , B08B3/04 , H05K3/068 , H05K13/0061
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公开(公告)号：EP0467118A2
公开(公告)日：1992-01-22
申请号：EP91110558.3
申请日：1991-06-26
发明人： Bard, Steven L. , Christensen, David N. , Glenning, John J. , Nicoletti, James A. , Urdanick, Mark W.
CPC分类号： C23F1/08 , B08B3/04 , H05K3/068 , H05K13/0061
摘要： A device (10) for applying fluid (e.g., etchant) to a substrate (19) (e.g., thin metallic tape) wherein the device (19) includes a head member (11) having means (13) therein for directing a first fluid (15) (e.g, etchant) at an established first pressure against the substrate (19) and means (23) for directing a second fluid (25) (e.g., air) at an established second pressure equal to or greater than the first pressure (at the location of fluid intersection) and against the substrate (19) in the area proximate the first fluid so as to substantially contain and limit the first fluid (15) to impingement substantially only at the location against which the first fluid (15) is designed to strike. Preferably, two opposing head members (11, 11') are utilized, and these may serve to maintain the substrate (19) therebetween in a suspended state. Both head members (11, 11') are movable relative to each other during fluid application. As stated, the device is particularly suited to function as an etcher, but may also serve other purposes (e.g., coating, cleaning, rinsing, etc.).
摘要翻译： 一种用于将液体（例如，蚀刻剂）施加到基底（19）（例如薄金属带）上的装置（10），其中所述装置（19）包括头部构件（11），所述头部构件具有用于引导第一流体 （15）（例如，蚀刻剂）以相对于基底（19）的确定的第一压力和用于以等于或大于第一压力的建立的第二压力引导第二流体（例如空气）的装置（23） （在流体交叉点的位置处）并且靠近第一流体的区域中的基板（19），以便基本上容纳和限制第一流体（15）以基本上仅在第一流体（15）的位置处冲击， 旨在罢工。 优选地，使用两个相对的头部构件（11,11'），并且它们可用于将衬底（19）保持在悬挂状态。 两个头部构件（11,11'）在流体施加期间可相对于彼此移动。 如所述，该装置特别适合用作蚀刻器，但也可用于其它目的（例如，涂覆，清洁，漂洗等）。
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