摘要:
A pointing system for controlling a cursor on a computer display device includes a single control actuator that ordinarily controls movement of the cursor on the display device and also detects if an applied cursor force matches a predetermined tap signature. If the applied force substantially matches the predetermined tap signature, then the system responds to the applied force by initiating one or more display actions rather than by moving the display cursor. The system detects tap signature forces applied along the x, y, and z axes of the control actuator and responds by retrieving a cursor context comprising a window display and corresponding cursor location from a queue and opening the associated window. That is, the system changes the active window from among windows of a graphical user interface, preserving the cursor position within each window. Other tap signature responses can correspond to functions initiated by programmable function keys or to user-defined functions. The force signature needed to initiate the display actions comprises a short duration, low level of force, such as a tap on the cursor control actuator that defines a sawtooth-type pulse having a rapidly rising leading edge and a slower falling trailing edge. Off-axis forces, which cannot be detected as occurring primarily along one of the three axes, are ignored to prevent inadvertent, undirected bumping of the control actuator from initiating unwanted action.
摘要:
A method of attachment of a thermally conductive element (28) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (38, 40). During the extrusion, the oxide coating (54) is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill (56) or section (74) of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.
摘要:
A method of attachment of a thermally conductive element (28) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (38, 40). During the extrusion, the oxide coating (54) is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill (56) or section (74) of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.
摘要:
An environmental interface for a semiconductor electro-optical conversion device layer that is optically transparent, electrically conductive and chemically passivating, made of an elemental semiconductor with an indirect band gap I> 1 electron volt in a layer between 2 and 20 nm thick. A GaAs (2) covered by GaAlAs converter with a 10 nm Si layer (6) over the GaAlAs (4) is illustrated.