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    Adaptive thermal gap pad
    2.
    发明公开
    Adaptive thermal gap pad 审中-公开
    AdaptorsWärmelückenpolster

    公开(公告)号：EP2466636A3

    公开(公告)日：2017-03-15

    申请号：EP11193504.5

    申请日：2011-12-14

    Applicant: Raytheon Company

    Inventor： Wong, Tse Eric ,  Chu, Charles ,  Koontz, Christopher R. ,  Sumner, Christal J.

    IPC: H01L23/433 ,  H01L23/42

    CPC classification number: H01L23/433 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  Y10T29/4935

    Abstract: The present invention relates to a thermal gap pad for transferring heat from a heat-supplying component such as an electronic device, and more specifically to a thermal gap pad with reduced compressive loading. In one embodiment, a thermal assembly includes a heat-supplying component, a cooling structure, a gap pad having a first surface, and a lubricant provided along the first surface of the gap pad. The lubricant has a viscosity of about 500 cP or less. The gap pad is compressed between the heat-supplying component and the cooling structure, such that the first surface of the gap pad is in thermal contact with the cooling structure.

    Abstract translation: 本发明涉及一种用于从诸如电子设备的供热部件传递热量的热间隙垫，更具体地涉及具有降低的压缩载荷的热间隙垫。 在一个实施例中，热组件包括供热部件，冷却结构，具有第一表面的间隙焊盘以及沿着间隙焊盘的第一表面设置的润滑剂。 润滑剂的粘度为约500cP以下。 间隙垫在供热部件和冷却结构之间被压缩，使得间隙焊盘的第一表面与冷却结构热接触。

    Heat radiation structure of electric apparatus
    4.
    发明公开
    Heat radiation structure of electric apparatus 有权
    Wärmestrahlungsmechanismuseines elektronischenGeräts

    公开(公告)号：EP2256908A3

    公开(公告)日：2016-12-28

    申请号：EP10163873.2

    申请日：2010-05-26

    Applicant: Sanyo Denki Co., Ltd.

    Inventor： Miyashita, Toshihito ,  Hioki, Hiroshi ,  Chikyu, Masakazu

    IPC: H02K11/00 ,  H02K5/18 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/552 ,  H05K7/20 ,  H02K9/22

    CPC classification number: H02K11/01 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L23/552 ,  H02K9/22 ,  H02K11/21 ,  H02K11/33

    Abstract: A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member.

    Abstract translation: 这里提供的电气设备的散热结构能够容易地将电子部件的热量释放到外部并抑制对旋转位置传感器的热传导。 金属电磁波屏蔽构件固定在壳体的壳体上。 电磁波屏蔽构件包括：第一部分，其连接到壳体的与电路基板相对的壁部分;以及圆柱形第二部分，其从第一部分的周边端部延伸并且沿着第二部分的周壁部分 壳体不与壳体接触。 具有电绝缘和导热性能以及柔性的导热构件设置在电路基板和电磁波屏蔽构件之间，以紧密接触多个电子部件和电磁波屏蔽构件的第一部分。

    Cooling arrangement for a power semiconductor module
    10.
    发明公开
    Cooling arrangement for a power semiconductor module 审中-公开
    Kühlanordnungfürein Leistungshalbleitemodul

    公开(公告)号：EP2849221A1

    公开(公告)日：2015-03-18

    申请号：EP13183978.9

    申请日：2013-09-11

    Applicant: ABB Technology AG

    Inventor： Hartmann, Samuel ,  Hajas, David ,  Berger, Andreas ,  Trüssel, Dominik

    IPC: H01L23/373 ,  H01L23/42 ,  H01L23/433

    CPC classification number: H01L23/42 ,  H01L23/433 ,  H01L2924/0002 ,  H05K1/0306 ,  H01L2924/00

    Abstract: A cooling arrangement (30a, 30b) for a power semiconductor module (10) comprises a thermally emitting surface (22) in thermal contact with at least one power semiconductor (16) of the power semiconductor module (10); a cooling body (24) in thermal contact with the thermally emitting surface (22) adapted for dissipating heat generated by the at least one power semiconductor (16); and a thermally conducting body (26a, 26b), which is arranged between the thermally emitting surface (22) and the cooling body (24), such that the heat emitted from the thermally emitting surface (22) is conducted via the thermally conducting body (26a, 26b) to the cooling body (24). The thermally conducting body (26a, 26b) comprises at least one foil (32, 32a, 32b) and a plastically deformable material (34) adapted for conduction heat, which is prevented to leak from the cooling arrangement (30a, 30b) by the at least one foil (32, 32a, 32b).

    Abstract translation: 用于功率半导体模块（10）的冷却装置（30a，30b）包括与功率半导体模块（10）的至少一个功率半导体（16）热接触的热发射表面（22）。 与热发射表面（22）热接触的冷却体（24），其适于消散由所述至少一个功率半导体（16）产生的热量; 以及布置在所述热发射表面（22）和所述冷却体（24）之间的导热体（26a，26b），使得从所述热发射表面（22）发射的热量经由所述导热体 （26a，26b）连接到冷却体（24）。 导热体（26a，26b）包括至少一个箔（32,32a，32b）和适于传导热的可塑性变形材料（34），其被防止从冷却装置（30a，30b）泄漏 至少一个箔片（32,32a，32b）。

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