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1.发明授权Method for producing metal layers on substrates by electroless plating techniques 失效通过电镀技术在基底上生产金属层的方法
公开(公告)号：EP0068276B1
公开(公告)日：1985-10-16
申请号：EP82105212.3
申请日：1982-06-15
CPC分类号： H05K3/38 , C23C18/1608 , C23C18/165 , C23C18/1696 , C23C18/34
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2.发明公开Method for producing metal layers on substrates by electroless plating techniques 失效一种用于通过化学镀技术来生产的在基材上的金属层的过程。
公开(公告)号：EP0068276A1
公开(公告)日：1983-01-05
申请号：EP82105212.3
申请日：1982-06-15
CPC分类号： H05K3/38 , C23C18/1608 , C23C18/165 , C23C18/1696 , C23C18/34
摘要： A method of providing a stress-free metal layer by electroless plating techniques, including the steps of providing a substrate that includes some glass material in at least the surface areas to receive a metal layer, depositing a layer of metal-boron by electroless plating techniques, and heating the resultant metal-boron layer in a non-reacting and/or H 2 environment at a temperature of at least 750 °C for a time sufficient to diffuse the boron to the glass material in the substrate.
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