公开(公告)号：EP2226407B1

公开(公告)日：2018-07-11

申请号：EP08866709.2

申请日：2008-11-14

申请人： Omron Corporation

发明人： NAKAJIMA, Seiji ,  HAYASE, Tetsuo ,  MORI, Tetsuya

IPC分类号： C23C18/18 ,  C23C18/20 ,  H01B13/00 ,  C23C18/06 ,  C23C18/08 ,  C23C18/14

CPC分类号： C23C18/14 ,  C23C18/06 ,  C23C18/08 ,  C23C18/1667 ,  C23C18/1678 ,  C23C18/1696 ,  C23C18/1893 ,  C23C18/2086 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： The process of the present invention for producing a metal film includes: forming an organic film using a primer composition containing an addition polymerizable compound including three or more reactive groups, an acid group-including addition polymerizable compound, and a hydrophilic functional group-including addition polymerizable compound; forming a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing the organic film with a metal (M2) ion aqueous solution containing a metal (M2) ion having less ionization tendency than the metal (M1) ion; reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film; and oxidizing the metal film. This provides (i) a process for producing a metal film and a metal pattern, at low cost, on an arbitrary substrate, (ii) a metal film, and (iii) use of the meta film.

公开(公告)号：EP2483442A1

公开(公告)日：2012-08-08

申请号：EP10759674.4

申请日：2010-09-30

申请人： Alchimer

发明人： MEVELLEC, Vincent ,  SUHR, Dominique

IPC分类号： C23C18/18 ,  C23C18/30

CPC分类号： C23C18/1882 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/1879 ,  C23C18/32 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76874 ,  H01L21/76898

摘要： The present invention relates to a solution and a method for activating the oxidized surface of a substrate, in particular of a semiconducting substrate, for its subsequent coating by a metal layer deposited by the electroless method. According to the invention, this composition contains: A) an activator consisting of one or more palladium complexes: B) a bifunctional organic binder consisting one or more organosilane complexes; C) a solvent system consisting one or more solvents for solubilizing the said activator and the said binder. Application: Fabrication of electronic devices such as in particular integrated circuits in particular three-dimensional.

摘要翻译： 本发明涉及一种溶液和用于激活基片的氧化表面，尤其是半导体基板，用于通过电解法沉积的金属层及其随后的涂层的方法。 。根据本发明，该组合物包含：A）以活化剂由一种或多种钯络合物; B）的双官能有机粘合剂由一种或多种有机硅烷复合物; C）的溶剂体系中由一种或多种的溶剂增溶的所述活化剂和所述粘结剂。

公开(公告)号：EP1953262A1

公开(公告)日：2008-08-06

申请号：EP06811039.4

申请日：2006-10-02

申请人： ALPS ELECTRIC CO., LTD.

发明人： MITSUMORI, Kenichi

IPC分类号： C23C18/18 ,  H05K3/18

CPC分类号： C23C18/30 ,  C23C18/1605 ,  C23C18/1696 ,  C23C18/1889 ,  C23C18/208 ,  C23C18/285 ,  C23C18/405 ,  H05K3/185 ,  H05K2203/0315 ,  H05K2203/1157

摘要： A catalyst layer which enables an electroless plating method to be carried out can be formed by an inexpensive and simple process without using palladium.
There are provided a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound; after the tin treatment step, a copper treatment step of bringing a substrate 1 into contact with a copper compound aqueous solution containing a copper compound; after the copper treatment step, a diluted sulfuric acid treatment step of bringing the substrate 1 into contact with diluted sulfuric acid; after the diluted sulfuric acid treatment step, a plating treatment step of bringing the substrate 1 into contact with a plating solution to form a copper plating film 2; and after the plating treatment step, a heat treatment step of heating the substrate 1 in an atmosphere substantially containing no oxygen and hydrogen.

摘要翻译： 这使得能够无电解镀方法的催化剂层，以进行可通过形成于廉价且简单的工艺不使用钯。 本发明提供一个使基板与锡化合物wässrige溶液含锡化合物接触的锡处理工序; 锡处理工序中，使一个基板1与铜化合物wässrige溶液含有铜化合物接触的铜处理工序后; 铜处理工序中，使基板1与稀硫酸接触的稀硫酸处理工序后; 稀硫酸处理工序后，使基材1与电镀液接触的镀敷处理工序，以形成铜镀膜-2; 和镀敷处理工序后，在气氛中加热在基板1实质上不含有氧气和氢气的热处理步骤。

公开(公告)号：EP1218937A2

公开(公告)日：2002-07-03

申请号：EP00963426.2

申请日：2000-09-13

申请人： Nutool, Inc.

发明人： UZOH, Cypria, Emeka ,  TALIEH, Homayoun ,  BASOL, Bulent

IPC分类号： H01L21/78 ,  H01L21/288 ,  C25D3/38

CPC分类号： C25D5/00 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/1848 ,  C23C18/31 ,  C25D5/02 ,  C25D5/10 ,  C25D5/22 ,  C25D5/34 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76855 ,  H01L21/76865 ,  H01L21/76871 ,  H01L21/76874 ,  H01L21/76876 ,  H01L21/76879 ,  H01L21/76885 ,  H01L24/11 ,  H01L2221/1089 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/3011

摘要： This invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed layer from a top surface of a substrate and then depositing a conductive material in the cavities of the substrate, where portions of the seed layer remains in the cavities. Another method includes forming an oxide layer on the top surface of the substrate such that the conductive material can be deposited in the cavities without the material being formed on the top surface of the substrate. The present invention also discloses methods for forming multi-level interconnects and the corresponding structures.

摘要翻译： 本发明涉及用于通过提供一种用于以更有效的和节省时间的方式在一个基片的空腔中沉积导电材料的方法制造高性能芯片互连和封装的方法。 这是通过选择性地从衬底的顶表面去除籽晶层的各部分，然后将导电材料沉积到所述基底，的空腔，其中所述籽晶层的部分保持在空腔来实现的。 另一种方法包括检测并导电材料可以在腔体被沉积而不材料的基板的顶表面上所形成的基板的顶表面上形成氧化物层的。 因此，本发明的圆盘更小的方法用于形成多级互连和相应的结构。

公开(公告)号：EP2483442B1

公开(公告)日：2014-11-12

申请号：EP10759674.4

申请日：2010-09-30

申请人： Alchimer

发明人： MEVELLEC, Vincent ,  SUHR, Dominique

IPC分类号： C23C18/16 ,  C23C18/32 ,  C23C18/18

CPC分类号： C23C18/1882 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/1879 ,  C23C18/32 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76874 ,  H01L21/76898

公开(公告)号：EP2770563A1

公开(公告)日：2014-08-27

申请号：EP12855538.0

申请日：2012-12-06

申请人： LG Chem, Ltd.

发明人： WOO, Sang-Wook ,  KIM, Je-Young

IPC分类号： H01M4/583 ,  H01M4/38 ,  H01M4/13 ,  H01M4/139 ,  H01M10/052

CPC分类号： H01M4/366 ,  B22F1/0085 ,  B22F1/02 ,  B22F2999/00 ,  C23C18/1635 ,  C23C18/1696 ,  C23C18/30 ,  C23C18/36 ,  H01M4/0452 ,  H01M4/0471 ,  H01M4/13 ,  H01M4/134 ,  H01M4/139 ,  H01M4/1395 ,  H01M4/38 ,  H01M4/386 ,  H01M4/583 ,  H01M4/587 ,  H01M4/62 ,  H01M10/052 ,  Y02E60/122 ,  Y02P70/54 ,  B22F2201/01

摘要： The present invention relates to an anode active material for lithium secondary batteries and a method for manufacturing same, the anode active material comprising: a core part including a carbon-silicon complex and having a cavity therein; and a coated layer which is formed on the surface of the core part and includes a phosphor-based alloy. The anode active material of the present invention, including the phosphor-based alloy coated layer formed on the surface of the carbon-silicon complex having the cavity therein, enables stress resulting from a volume expansion caused by the alloying of lithium and Si to be released by coating the surface of an Si-based active material with a phosphor-based alloy. Also, the manufacturing method for the anode active material according to the present invention enables easy adjustment of the thickness of the coated layer.

摘要翻译： 本发明涉及一种用于锂二次电池的负极活性材料及其制造方法，所述负极活性材料包括：包含碳 - 硅复合物并在其中具有空腔的芯部; 以及形成在芯部的表面上并且包括磷光体基合金的涂层。 本发明的负极活性物质包括在其中具有空腔的碳 - 硅复合物的表面上形成的基于荧光体的合金涂层，使得由锂和Si的合金化引起的体积膨胀产生的应力释放 通过用荧光体基合金涂覆Si基活性材料的表面。 此外，根据本发明的负极活性材料的制造方法能够容易地调节涂层的厚度。

公开(公告)号：EP2752502A1

公开(公告)日：2014-07-09

申请号：EP12828406.4

申请日：2012-08-03

申请人： Kabushiki Kaisha Toyota Chuo Kenkyusho

发明人： YAMADA Yuka ,  MATSUOKA Hideaki ,  SUZUKI Ken-ichi ,  KITAHARA Gaku

IPC分类号： C23C18/36

CPC分类号： C23C18/36 ,  C22C21/00 ,  C22C21/06 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/1696 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/54 ,  C25D5/40 ,  C25D5/50

摘要： Provided is a wear resistant aluminum alloy member. The wear resistant aluminum alloy member of the present invention comprises a substrate comprising an aluminum alloy, and a coated layer coating at least part of a surface of the substrate, and is characterized in that the aluminum alloy has a residual hardness of 120 Hv or more when measured in a room temperature state after held in an atmospheric pressure environment at 400 deg. C for 10 hours; and the coated layer comprises a crystalline Ni-P layer comprising Ni and Ni 3 P. This crystalline Ni-P layer can be obtained by heating a Ni-P plated layer, which has been formed on the surface of the substrate by electroless Ni-P plating, for example, at 300 deg. C or more. Compressive residual stress is imparted to the crystalline Ni-P layer. It is preferred that the aluminum alloy contains 1 to 7 % of Fe because a crystalline Ni-P layer having high adhesion can be obtained.

公开(公告)号：EP2204464A1

公开(公告)日：2010-07-07

申请号：EP08844330.4

申请日：2008-10-30

申请人： JFE Steel Corporation

发明人： SATO, Nobuyuki ,  SUGANO, Takahiro ,  YAMAGAMI, Hiroki ,  FUKUI, Takayuki

IPC分类号： C23C2/26 ,  C23C2/36

CPC分类号： C21D9/561 ,  B05B15/00 ,  B05C3/125 ,  B05C11/1015 ,  C23C2/003 ,  C23C2/06 ,  C23C2/26 ,  C23C2/40 ,  C23C18/1696

摘要： An apparatus for manufacturing a molten zinc coated steel sheet includes a molten zinc coating device, a temper rolling mill, an acid solution contacting device, and a cleaning device that are connected in tandem, wherein the acid solution contacting device and the cleaning device are separated from each other with a region therebetween and means for controlling absolute humidity is disposed in the region. The means for controlling absolute humidity, for example, includes a cover that covers an upper surface, a lower surface, and two side surfaces of a steel sheet and through which the steel sheet can be passed; blowing means for blowing water vapor or dry air into the cover; and measuring means for measuring temperature and relative humidity, or a dew point. A necessary oxide film can be stably formed with reliability on a surface of a molten zinc coated steel sheet without degrading the appearance of the steel sheet surface with the apparatus for manufacturing a molten zinc coated steel sheet.

摘要翻译： 熔融镀锌钢板的制造装置包括串联连接的熔融锌涂装置，回火轧机，酸溶液接触装置和清洗装置，其中酸溶液接触装置和清洗装置分离 彼此之间具有区域，并且用于控制绝对湿度的装置设置在该区域中。 用于控制绝对湿度的方法例如包括覆盖钢板的上表面，下表面和两个侧表面的盖，钢板可以通过该盖板通过; 用于将水蒸气或干燥空气吹入盖子的吹风装置; 以及用于测量温度和相对湿度或露点的测量装置。 利用熔融镀锌钢板的制造装置，可以在熔融镀锌钢板的表面上可靠地稳定地形成必要的氧化膜，而不会降低钢板表面的外观。

公开(公告)号：EP1978129A2

公开(公告)日：2008-10-08

申请号：EP08005860.5

申请日：2008-03-27

申请人： EBARA CORPORATION

发明人： Yakuwa, Hiroshi

IPC分类号： C23C18/50 ,  C25D3/12 ,  C25D5/48

CPC分类号： C23C18/1254 ,  C23C10/02 ,  C23C10/48 ,  C23C10/52 ,  C23C18/1216 ,  C23C18/1696 ,  C23C18/32 ,  C23C18/50 ,  C23C28/021 ,  C25D3/12 ,  C25D5/48 ,  C25D5/50 ,  Y02T50/67 ,  Y10T428/31678

摘要： There is provided a method for forming a corrosion-resistant protective film, which can preventing peel off of the protective film and enables long-term stable use of the film under high-temperature conditions. The corrosion-resistant film forming method includes the steps of: carrying out Ni (or Ni-B) plating of a surface of a substrate of a Ni-Cr alloy to form a Ni (or Ni-B) layer on the substrate surface; and carrying out Al diffusion treatment of the surface of the Ni (or Ni-B) layer to form a protective layer of Ni-Al.

摘要翻译： 提供了形成耐腐蚀保护膜的方法，其可以防止保护膜剥离，并能够在高温条件下长期稳定地使用该膜。 耐腐蚀成膜方法包括以下步骤：对Ni-Cr合金基材的表面进行Ni（或Ni-B）电镀以在基材表面上形成Ni（或Ni-B）层; 对Ni（或Ni-B）层的表面进行Al扩散处理，形成Ni-Al的保护层。

公开(公告)号：EP1562411A1

公开(公告)日：2005-08-10

申请号：EP05001964.5

申请日：2005-01-31

申请人： Dowa Mining Co., Ltd.

发明人： Tsukaguchi, Nobuyoshi ,  Iyoda, Ken

IPC分类号： H05K3/24 ,  C23C18/16

CPC分类号： H01L23/3735 ,  C23C18/1608 ,  C23C18/1696 ,  C23C18/1831 ,  C23C18/32 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/24 ,  H05K3/243 ,  H05K2201/0355 ,  H05K2203/072 ,  H05K2203/0793 ,  H01L2924/00

摘要： In a method for producing a metal/ceramic bonding member wherein an electroless nickel alloy plating layer 18 is formed on a predetermined portion of the surface of an aluminum plate 12 which is bonded to at least one side of a ceramic substrate 10 and which is formed so as to have a predetermined circuit pattern, an alkali peeling type resist 16 having a predetermined shape is applied on the surface of the aluminum plate 12 before forming the electroless nickel alloy plating layer 18, and then, a portion of the surface of the aluminum plate 12, on which the resist 16 is not applied, is activated with an acidic zinc immersion solution containing a fluoride or silicofluoride. Then, after the electroless nickel alloy plating layer 18 is formed, the resist 16 is removed with an alkali.

摘要翻译： 在一种金属/陶瓷接合部件的制造方法中，其中在铝板12的表面的规定部分上形成有化学镀镍合金镀层18，该铝板12与陶瓷基板10的至少一面接合并形成 为了具有预定的电路图案，在形成无电镍合金镀层18之前，在铝板12的表面上施加具有预定形状的碱剥离型抗蚀剂16，然后将铝的一部分表面 未施加抗蚀剂16的板12用含有氟化物或氟化硅的酸性锌浸渍溶液活化。 然后，在形成化学镀镍合金镀层18之后，用碱除去抗蚀剂16。