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1.发明公开
公开(公告)号：EP0588746A1
公开(公告)日：1994-03-23
申请号：EP93480119.2
申请日：1993-08-24
CPC分类号： H04B10/801 , G06F1/105
摘要： A method of clocking integrated circuit chips. A pulsed laser (16) striking an integrated circuit module substrate (14) is diffused through the substrate and exits the opposite surface as diffused light pulses. An integrated circuit chip (10) mounted on the top surface of the substrate has at least one optical receiver (17). The optical receiver receives the pulsed energy from the diffused light pulses, converting them to electrical pulses that clock the chip.
摘要翻译： 集成电路芯片时钟的方法。 撞击集成电路模块衬底（14）的脉冲激光（16）通过衬底扩散并作为漫射光脉冲离开相对表面。 安装在基板的顶表面上的集成电路芯片（10）具有至少一个光接收器（17）。 光接收器从扩散的光脉冲接收脉冲能量，将其转换成对芯片进行时钟的电脉冲。
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公开(公告)号：EP0168609B1
公开(公告)日：1988-01-13
申请号：EP85106817.1
申请日：1985-06-03
CPC分类号： C23C8/10 , H01L21/31683 , H05K3/225
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公开(公告)号：EP0168609A1
公开(公告)日：1986-01-22
申请号：EP85106817.1
申请日：1985-06-03
CPC分类号： C23C8/10 , H01L21/31683 , H05K3/225
摘要： A method is taught for repairing pinholes (12) in dielectric layers (13) and thereby avoiding metal shorts. The method is applied after the dielectric (13) has been deposited on a base of conductive metallurgy (16) and involves heating the metal-dielectric layers in an oxygen ambient and thereby oxidizing any exposed metal (16). The metal-oxide (15) formed in the pinhole effectively insulates the underlying metal (16) from a subsequently deposited metal (14); and, hence acts to prevent metal-to-metal shorts.
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