公开(公告)号：EP3003966A1

公开(公告)日：2016-04-13

申请号：EP14808422.1

申请日：2014-05-23

申请人： InvenSense, Inc.

发明人： ZHANG, Cerina ,  TEA, Nim

IPC分类号： B81B7/02

CPC分类号： B81C1/00984 ,  B81B3/0008 ,  B81B2207/015 ,  B81C1/00976 ,  B81C2201/115 ,  H01L21/76838 ,  H01L23/48 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.

摘要翻译： 本发明的方法包括通过提供用于收集在形成在衬底上的凸块上的电荷的导电路径来减少MEMS器件的静摩擦。 通过在基板上沉积并图案化电介质材料来形成凸块，并且通过沉积在凸块上的导电层来提供导电路径。 导电层也可以粗糙化以减少静摩擦。

公开(公告)号：EP3003966B1

公开(公告)日：2018-06-20

申请号：EP14808422.1

申请日：2014-05-23

申请人： InvenSense, Inc.

发明人： ZHANG, Cerina ,  TEA, Nim

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81C1/00984 ,  B81B3/0008 ,  B81B2207/015 ,  B81C1/00976 ,  B81C2201/115 ,  H01L21/76838 ,  H01L23/48 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.