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1.发明授权METHOD FOR THE PRODUCTION OF A LEAD-FREE TIN, SILVER, COPPER ALLOY SOLDER COMPOSITION AND AN ELECTRONIC STRUCTURE 有权制造方法焊料组合物无铅的锡 - 银 - 铜合金与电子结构
公开(公告)号：EP1483419B1
公开(公告)日：2013-08-28
申请号：EP03707862.3
申请日：2003-02-11
Applicant: Invensas Corporation
Inventor： CHOI, Won, K. , GOLDSMITH, Charles, C. , GOSSELIN, Timothy, A. , HENDERSON, Donald, W. , KANG, Sung, K. , PUTTLITZ, Karl J., Sr. , SHIH, Da-Yuan
CPC classification number: C22C13/00 , B23K35/262 , B23K2201/36 , H01L24/11 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2924/01322 , H01L2924/14 , H05K3/3436 , H05K3/3463 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , H01L2924/00
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