公开(公告)号：EP1522567A4

公开(公告)日：2005-11-16

申请号：EP03728056

申请日：2003-05-12

Applicant: JSR CORP

Inventor： YOKOYAMA YASUAKI ,  BESSHO NOBUO ,  HANAMURA MASAAKI

IPC: B24B37/04 ,  B24B45/00 ,  C09J11/00 ,  C09J5/00 ,  C09J7/00 ,  C09J201/00 ,  H01L21/301 ,  H01L21/304

CPC classification number: B24B37/042 ,  B24B37/30 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/1059

Abstract: The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.