Abstract:
A polysiloxane resin exhibiting high transparency even at a wavelength of 193nm (particularly 157nm) or below and excellent dry etching resistance, which comprises units represented by the general formula (I) and/or the general formula (II) and has acid−dissociable groups: (I) (II) (wherein R 1 is a fluorinated or fluoroalkylated monovalent aromatic group or a fluorinated or fluoroalkylated monovalent alicyclic group; and R 2 is a monovalent aromatic group described above, a monovalent alicyclic group described above, hydrogen, halogeno, a monovalent hydrocarbon group, haloalkyl, or amino). A radiation−sensitive resin composition excellent in sensitivity and resolution, which comprises (A) the above resin and (B) a radiation−sensitive acid generator.