摘要:
The invention provides a displacement electroless gold plating solution that is low in toxicity, can be used at a pH near to neutrality, and affords good solder adhesion and film adhesion. The displacement electroless gold plating solution contains a non-cyanide water-soluble gold compound and a hydrogensulfite compound. Preferably, the plating solution further contains a thiosulfuric acid compound or an aminocarboxylic acid compound. Sodium hydrogensulfite, potassium hydrogensulfite, ammonium hydrogensulfite or the like can be used as the hydrogensulfite compound.
摘要:
The object of this invention is to provide a silver-coated material of excellent abrasion resistance in which, even when used as, for example, a moving contact and/or a fixed contact in a switch used over an extended period of time under conditions where switching is repeatedly carried out, the silver or silver alloy layer at the surface does not wear away and, moreover, the contact resistance does not rise. A silver-coated material having, as an outermost layer on an electrically conductive base material, a layer made of at least silver or a silver alloy, this silver-coated material having a coating loss, in an abrasion resistance test, of less than 40 mg and having an initial contact resistance of less than 10 mΩ and a contact resistance of less than 10 mΩ after a sliding wear test carried out under certain conditions.