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公开(公告)号：EP4317536A1
公开(公告)日：2024-02-07
申请号：EP22832665.8
申请日：2022-05-27
发明人： HIRAI, Yutaro , ARAI, Kentaro , SATO, Yosuke , FUNADA, Eri
摘要： There is provided a silver-plated product having a more excellent wear resistance than that of conventional silver-plated products while maintaining the high hardness thereof, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating in a silver-plating solution which is an aqueous solution containing silver potassium cyanide, potassium cyanide and a mercaptothiazole, the concentration of the mercaptothiazole in the silver-plating solution is not lower than 5 g/L, and the electroplating is carried out at a liquid temperature of not lower than 30 °C and at a current density of 1 to 15 A/cm 2 .
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3.发明公开
公开(公告)号：EP4227444A1
公开(公告)日：2023-08-16
申请号：EP22779106.8
申请日：2022-03-31
发明人： SHEN, Qi , LIN, Junyu , ZHENG, Jianyong , HU, Yiming , WANG, Chuan , LIN, Rongzhen , JI, Shen , XU, Zhengli , ZHOU, Jinyu , ZENG, Lang
摘要： The present invention relates to the field of material technologies, and more particularly to a compound dispersant which is composed of distilled water, a nonionic surfactant, an anionic surfactant and a wetting agent. The nonionic surfactant is a Tween compound, and the anionic surfactant is hydrocarbyl sulfate salts; and the compound dispersant can block or slow down agglomeration of graphene in a dispersion solution. The present invention further relates to a preparation method of the compound dispersant, which is simple to operate. The present invention further relates to a mixed electroplating solution containing the compound dispersant, in which the graphene is dispersed uniformly and stably. The present invention further relates to a preparation method of the mixed electroplating solution, in which graphene is distributed uniformly and stably.
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公开(公告)号：EP4163422A1
公开(公告)日：2023-04-12
申请号：EP21868925.5
申请日：2021-03-24
发明人： HIRAI, Yutaro , ARAI, Kentaro , SATO, Yosuke
IPC分类号： C25D3/46
摘要： There are provided a silver-plated product having a more excellent wear resistance than that of conventional silver-plated products, and a method for producing the same. The method comprises the steps of: preparing a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof; and forming a surface layer of silver on a base material by electroplating at a liquid temperature and at a current density in the silver-plating solution so as to satisfy (BC/A) 2 /D ≧ 10 (°C 2 · dm 2 /A) assuming that a concentration of free cyanide in the silver-plating solution is A (g/L), that a concentration of a benzothiazole content of the benzothiazole or derivative thereof in the silver-plating solution is B (g/L), that the liquid temperature of the silver-plating solution is C (°C) and that the current density during the electroplating is D (A/dm 2 ),
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公开(公告)号：EP4139507A1
公开(公告)日：2023-03-01
申请号：EP21792130.3
申请日：2021-04-23
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公开(公告)号：EP4083270A1
公开(公告)日：2022-11-02
申请号：EP21759554.5
申请日：2021-01-14
发明人： HIRAI, Yutaro , ARAI, Kentaro , SATO, Yosuke
摘要： There are provided a silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating at a current density in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzimidazole (such as 2-mercaptobenzmimidazole or 2-mercaptobenzimidazole sulfonic acid sodium salt dihydrate), the ratios of the concentrations of silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and the imidazole to the current density during the silver-plating (or the ratios of the concentrations of silver potassium cyanide or silver cyanide and the imidazole to the current density during the silver plating, and the concentration of potassium cyanide or sodium cyanide) are set to be predetermined ranges, respectively.
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公开(公告)号：EP3078767B1
公开(公告)日：2021-05-26
申请号：EP14859853.5
申请日：2014-10-31
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公开(公告)号：EP3070726B1
公开(公告)日：2019-05-15
申请号：EP14861043.9
申请日：2014-11-10
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公开(公告)号：EP2759622B1
公开(公告)日：2018-11-28
申请号：EP12834344.9
申请日：2012-09-10
IPC分类号： B32B15/01 , C22C5/06 , C22C5/08 , C22C5/10 , C22C9/02 , C22C9/04 , C22C13/02 , C22C19/03 , C22C19/07 , C22C22/00 , C22C27/06 , C22C38/00 , C25D5/10 , C25D5/12 , C25D5/50 , C23C18/16 , H05K3/24 , H01B1/02 , C25D3/12 , C25D3/20 , C25D3/30 , C25D3/38 , C25D3/46 , C25D3/50 , C25D3/56 , C25D3/62 , C25D3/64 , H01R13/03 , H05K1/11
CPC分类号： H01B1/02 , B32B15/01 , B32B15/018 , C22C5/06 , C22C5/08 , C22C5/10 , C22C9/00 , C22C9/02 , C22C9/04 , C22C13/00 , C22C13/02 , C22C19/03 , C22C19/07 , C22C22/00 , C22C27/06 , C22C38/00 , C23C18/1651 , C23C18/1692 , C25D3/12 , C25D3/20 , C25D3/30 , C25D3/38 , C25D3/46 , C25D3/50 , C25D3/567 , C25D3/62 , C25D3/64 , C25D5/10 , C25D5/12 , C25D5/505 , H01R13/03 , H05K1/117 , H05K1/118 , H05K3/244 , H05K2201/0341 , Y10T428/12681 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 µm, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 µm.
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公开(公告)号：EP3149222A4
公开(公告)日：2018-06-06
申请号：EP15798809
申请日：2015-05-26
申请人： AUCKLAND UNISERVICES LTD , HU BO , XIONG CHAO
发明人： HU BO , XIONG CHAO , GAO WEI , WANG YUXIN , SHU XIN , WEI SHANGHAI , GHAZIOF SOROOR , TAY SEE LENG , JU YING , SHARIFI MARZIEH , GOODE CHRISTOPHER W , SLATER GLEN
IPC分类号： C23C18/16 , C23C18/34 , C23C18/36 , C25D1/00 , C25D3/46 , C25D3/56 , C25D3/62 , C25D5/00 , C25D13/10 , C25D15/00 , C25D15/02 , C25D21/02 , C25D21/10 , C25D21/12 , C25D21/14
CPC分类号： C25D15/00 , C23C18/1662 , C23C18/1669 , C23C18/1675 , C23C18/1676 , C23C18/34 , C23C18/36 , C25D3/46 , C25D3/56 , C25D3/562 , C25D3/565 , C25D3/62 , C25D21/02 , C25D21/10 , C25D21/12
摘要： N comprises adding a sol of a ceramic phase to a plating solution or electrolyte and controlling the pH, degree of mixing, and/or temperature of the plating solution or electrolyte. An item or surface comprising a substrate and a metal-ceramic composite coating on the substrate, the metal-ceramic composite coating comprising a ceramic phase of dispersed amorphous ceramic particles having an average diameter of from 1 to 100 nm is also provided.
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