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公开(公告)号:EP0337482B1
公开(公告)日:1994-11-09
申请号:EP89106712.6
申请日:1989-04-14
CPC分类号: H01L27/0248 , H01L29/417 , H01L29/8611
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公开(公告)号:EP0337482A3
公开(公告)日:1990-10-31
申请号:EP89106712.6
申请日:1989-04-14
CPC分类号: H01L27/0248 , H01L29/417 , H01L29/8611
摘要: A semiconductor device is disclosed which constitutes a protection diode including a second region (23) of first conductivity type beneath a marginal portion (28′) of an interconnection pad which is not utilized for bonding. The second region (23), together with an area (24) of second conductivity type, constitutes the protection diode for protection against a possible negative surge voltage.
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公开(公告)号:EP0337482A2
公开(公告)日:1989-10-18
申请号:EP89106712.6
申请日:1989-04-14
CPC分类号: H01L27/0248 , H01L29/417 , H01L29/8611
摘要: A semiconductor device is disclosed which constitutes a protection diode including a second region (23) of first conductivity type beneath a marginal portion (28′) of an interconnection pad which is not utilized for bonding. The second region (23), together with an area (24) of second conductivity type, constitutes the protection diode for protection against a possible negative surge voltage.
摘要翻译: 公开了一种半导体器件,其构成保护二极管,其包括第一导电类型的第二区域(23),该第二区域(23)在互连焊盘的边缘部分(28分钟)之下,其不用于接合。 第二区域(23)与第二导电类型的区域(24)一起构成用于防止可能的负浪涌电压的保护二极管。
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