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公开(公告)号:EP0202895A2
公开(公告)日:1986-11-26
申请号:EP86303764.4
申请日:1986-05-16
发明人: Yamada, Yutaka , Murase, Satoru , Sasaki, Mitsuo , Nakamura, Ei , Kumakura, Hiroaki , Togano, Kazumasa , Tachikawa, Kyoji
IPC分类号: H01L39/24
CPC分类号: H01L39/2412 , H01L39/24 , H01L39/2409 , H01L39/2416 , Y10S148/903 , Y10S505/823 , Y10T29/49014
摘要: A powder having a predetermined composition is filled in a tube. The tube is drawn to obtain a wire and the wire is rolled to obtain a tape-like starting body (7). Then, a laser beam (3) is irradiated on the part of the tape to heat and melt the part of the tape. The starting body (7) is rapidly heated and then cooled, thereby the part of the starting body is melted and solidified to form a compound superconductor layer (12).
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公开(公告)号:EP0202895A3
公开(公告)日:1988-11-17
申请号:EP86303764
申请日:1986-05-16
发明人: Yamada, Yutaka , Murase, Satoru , Sasaki, Mitsuo , Nakamura, Ei , Kumakura, Hiroaki , Togano, Kazumasa , Tachikawa, Kyoji
IPC分类号: H01L39/24
CPC分类号: H01L39/2412 , H01L39/24 , H01L39/2409 , H01L39/2416 , Y10S148/903 , Y10S505/823 , Y10T29/49014
摘要: A powder having a predetermined composition is filled in a tube. The tube is drawn to obtain a wire and the wire is rolled to obtain a tape-like starting body (7). Then, a laser beam (3) is irradiated on the part of the tape to heat and melt the part of the tape. The starting body (7) is rapidly heated and then cooled, thereby the part of the starting body is melted and solidified to form a compound superconductor layer (12).
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公开(公告)号:EP0202895B1
公开(公告)日:1996-03-20
申请号:EP86303764.4
申请日:1986-05-16
发明人: Yamada, Yutaka , Murase, Satoru , Sasaki, Mitsuo , Nakamura, Ei , Kumakura, Hiroaki , Togano, Kazumasa , Tachikawa, Kyoji
IPC分类号: H01L39/24
CPC分类号: H01L39/2412 , H01L39/24 , H01L39/2409 , H01L39/2416 , Y10S148/903 , Y10S505/823 , Y10T29/49014
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4.
公开(公告)号:EP3375549A1
公开(公告)日:2018-09-19
申请号:EP18158434.3
申请日:2018-02-23
CPC分类号: B29C64/268 , B22F3/105 , B22F3/1055 , B23K26/352 , B29C64/153 , B29C64/209 , B29C64/371 , B29C67/04 , B29K2105/251 , B33Y10/00 , B33Y30/00 , C04B35/64 , H01S5/3401 , H01S5/4025
摘要: According to an arrangement, an additive manufacturing apparatus (1) includes a first irradiation unit (42), and a first emission device (41). The first irradiation unit (42) is configured to irradiate a material (3) with first light (L1) to melt or sinter the material (3). The first emission device (41) includes a first light source (41a) configured to emit the first light (L1), is configured to cause the first light (L1) emitted from the first light source (41a) to enter the first irradiation unit (42), and is capable of changing a wavelength of the first light (L1) entering the first irradiation unit (42).
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