公开(公告)号：EP1481279A2

公开(公告)日：2004-12-01

申请号：EP03715985.2

申请日：2003-02-05

申请人： KLA-Tencor Technologies Corporation

发明人： LANGE, Steven, R.

IPC分类号： G02B27/12 ,  G02B21/06 ,  G02B15/14 ,  G02B5/08 ,  G21K7/00

CPC分类号： G02B17/086 ,  G02B17/0808 ,  G02B17/0856 ,  G02B17/0892 ,  G02B21/0016 ,  G02B21/025 ,  G02B21/04 ,  G02B21/18 ,  G02B21/367

摘要： Techniques for utilizing a microscope inspection system (100) capable of inspecting specimens (112) at high throughput rates are described. The inspection system achieves the higher throughput rates by utilizing more than one detector array (116) and a large field of view to scan the surface of the semiconductor wafers. The microscope inspection system also has high magnification capabilities, a high numerical aperture, and a large field of view. By using more than one detector array, more surface area of a wafer can be inspected during each scanning swath across the semiconductor wafers. The microscope inspection system is configured to have a larger field of view so that the multiple detector arrays can be properly utilized. Additionally, special arrangements of reflective and/or refractive surfaces are used in order to fit the detector arrays within the physical constraints of the inspection system.

公开(公告)号：EP1481279B1

公开(公告)日：2013-06-19

申请号：EP03715985.2

申请日：2003-02-05

申请人： KLA-Tencor Technologies Corporation

发明人： LANGE, Steven, R.

IPC分类号： G02B21/00 ,  G02B21/18 ,  G02B17/08 ,  G02B21/36 ,  G02B21/02 ,  G02B17/04 ,  G02B21/04

CPC分类号： G02B17/086 ,  G02B17/0808 ,  G02B17/0856 ,  G02B17/0892 ,  G02B21/0016 ,  G02B21/025 ,  G02B21/04 ,  G02B21/18 ,  G02B21/367

公开(公告)号：EP1869435A1

公开(公告)日：2007-12-26

申请号：EP06739004.7

申请日：2006-03-21

申请人： KLA-Tencor Technologies Corporation

发明人： LANGE, Steven, R.

IPC分类号： G01N21/95 ,  G01N21/88

CPC分类号： G02B17/061 ,  G01N21/9501 ,  G01N2021/9563 ,  G01N2201/0636

摘要： All-reflective optical systems for broadband wafer inspection are provided. One system configured to inspect a wafer includes an optical subsystem. All light-directing components of the optical subsystem are reflective optical components except for one or more refractive optical components, which are located only in substantially collimated space. The refractive optical component(s) may include, for example, a refractive beamsplitter element that can be used to separate illumination and collection pupils. The optical subsystem may also include one or more reflective optical components located in substantially collimated space. The optical subsystem is configured for inspection of the wafer across a waveband of greater than 20 nm. In some embodiments, the optical subsystem is configured for inspection of the wafer at wavelengths less than and greater than 200 nm.

摘要翻译： 提供了用于宽带晶圆检测的全反射光学系统。 配置为检查晶片的一个系统包括光学子系统。 光学子系统的所有光指向部件都是反射光学部件，除了一个或多个折射光学部件，其仅位于基本准直的空间中。 折射光学部件可以包括例如可用于分离照明和收集瞳孔的折射分束器元件。 光学子系统还可以包括位于基本上准直的空间中的一个或多个反射光学部件。 光学子系统被配置用于跨越大于20nm的波段检查晶片。 在一些实施例中，光学子系统被配置为在小于或大于200nm的波长下检查晶片。