SOLDER INSPECTION APPARATUS AND FEEDBACK INFORMATION GENERATION METHOD FOR SOLDER INSPECTION APPARATUS
    1.
    发明公开
    SOLDER INSPECTION APPARATUS AND FEEDBACK INFORMATION GENERATION METHOD FOR SOLDER INSPECTION APPARATUS 审中-公开
    LOTPRÜFVORRICHTUNGUND VERFAHREN ZUR ERZEUGUNG VONRÜCKPOPPLUNGSINFORMATIONENFÜRLOTPRÜFVORRICHTUNG

    公开(公告)号:EP3184302A4

    公开(公告)日:2017-09-20

    申请号:EP15833286

    申请日:2015-08-17

    摘要: A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.

    摘要翻译: 一种焊料检查装置的反馈信息生成方法,其特征在于,包括:接收设置在所述焊料检查装置和用于在印刷电路板上印刷焊料的丝网印刷机之间的缓冲器的数量的信息的输入,并且被配置为支撑所述印刷电路板 引入到焊料检查装置中以便将印刷电路板置于待命状态; 利用所述输入信息和所述焊料检查装置对所述印刷电路板的检查结果生成反馈信息; 并将反馈信息传输给丝网印刷机。 考虑到缓冲器的数量可以生成反馈信息,从而防止反馈信息被过度生成,并且确保反馈信息的准确性。