公开(公告)号：EP0212227A3

公开(公告)日：1987-05-13

申请号：EP86109558

申请日：1986-07-12

Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION

Inventor： Swiggett, Brian Edward ,  Morino, Ronald ,  Keogh, Raymond J. ,  Szenczy, George ,  Crowell, Jonathan Clark ,  Schoenberg, Andrew Jed ,  Friedrich, Marju Laube

IPC: H05K07/06

CPC classification number: H05K3/103 ,  H05K3/222 ,  H05K3/386 ,  H05K3/429 ,  H05K7/06 ,  H05K2201/10287 ,  H05K2203/0746 ,  H05K2203/0776 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T29/49162

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.

公开(公告)号：EP0212238A3

公开(公告)日：1988-07-06

申请号：EP86109606

申请日：1986-07-14

Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION

Inventor： Schoenberg, Andrew Jed ,  Friedrich, Marju Jaube

IPC: C09J03/16

CPC classification number: C09J167/00 ,  C08G18/791 ,  C08G59/18 ,  C08G59/40 ,  C09J175/04 ,  H05K3/103 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2201/10287 ,  H05K2203/0285 ,  H05K2203/1105

Abstract: A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultra­sonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, poly­urethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second com­ponent being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initi­ating a reactio n with the functional groups of the poly­meric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will acti­vate the adhesive composition, said curing agent being pre­sent in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composi­tion is suitable for bonding wire to a surface, to another wire or to itself.